CEVA REVEALS PRICING FOR UNDERWRITTEN PUBLIC OFFERING OF COMMON STOCK
Public Offering Announcement: Ceva, Inc. has priced a public offering of 3,000,000 shares of common stock at $19.50 per share, aiming to raise approximately $58.5 million before expenses, with a closing date expected on November 20, 2025.
Use of Proceeds: The funds raised will enhance Ceva's financial flexibility and may be used for acquisitions, investments in complementary technologies, working capital, capital expenditures, and share repurchases.
Underwriters Involved: J.P. Morgan is the lead book-running manager, with UBS, TD Cowen, and Stifel also participating as book-running managers, while several firms are acting as co-managers for the offering.
Forward-Looking Statements: The press release includes forward-looking statements regarding market conditions and the anticipated use of proceeds, cautioning that actual results may differ due to various risks and uncertainties.
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- Award Recognition: Ceva's Ceva-NeuPro-Nano neural processing unit won the Artificial Intelligence category at the 2026 Embedded Awards in Nuremberg, Germany, highlighting its innovative capabilities in the embedded systems industry and reinforcing the company's leadership in edge AI.
- Efficient Inference Capabilities: This NPU IP delivers powerful AI inference capabilities with exceptional energy efficiency and minimal silicon footprint, enabling advanced AI workloads directly on resource-constrained edge devices, thus driving applications in smart sensors, wearables, and industrial IoT.
- Growing Market Demand: In 2025, ten customers licensed NeuPro technologies across consumer IoT, industrial, and automotive sectors, reflecting the increasing market demand for efficient on-device AI processing, which further propels Ceva's business growth.
- Future of Physical AI: Ceva's NeuPro-Nano not only supports modern neural networks but also empowers intelligent devices to perceive, understand, and act locally, marking a transition towards Physical AI and positioning the company favorably in the rapidly evolving smart edge product market.
- Award Recognition: Ceva's Ceva-NeuPro-Nano neural processing unit won the 2026 Artificial Intelligence Award at the Embedded World Exhibition in Nuremberg, Germany, highlighting its capability for ultra-efficient AI acceleration in resource-constrained devices and solidifying Ceva's leadership in the smart edge market.
- Technical Advantages: NeuPro-Nano delivers exceptional energy efficiency and minimal silicon footprint, supporting modern neural networks to enable efficient AI inference on edge devices such as smart sensors, wearables, and industrial IoT systems, addressing the growing demand for intelligent devices in the market.
- Growing Market Demand: In 2025, Ceva licensed its NeuPro technology to 10 customers across consumer IoT, industrial, and automotive sectors, reflecting the increasing market demand for efficient on-device AI processing, which is driving the company's market share in smart edge products.
- Strategic Vision: Ceva's Executive Vice President Yaron Galitzky stated that the award validates their vision for scalable, energy-efficient edge AI, aiming to provide practical Physical AI capabilities for cost- and power-constrained edge products, thus advancing the development of the next generation of intelligent devices.
- Technological Innovation: Ceva's Ceva-Waves™ UWB IP is the industry's first IEEE 802.15.4ab-compliant UWB IP, delivering up to 30x extended range and 4x faster data rates, significantly enhancing security and energy efficiency across consumer, automotive, and industrial systems.
- Growing Market Demand: According to ABI Research, UWB shipments exceeded 563 million units in 2025 and are forecasted to surpass 1.4 billion by 2030, indicating rapid adoption of UWB in positioning, radar sensing, and high-performance data applications.
- Ecosystem Readiness: Ceva is collaborating closely with LitePoint to facilitate early validation of the IEEE 802.15.4ab standard, ensuring device manufacturers can achieve faster time-to-market and higher interoperability, thereby accelerating the commercialization of UWB technology.
- Key for Physical AI: The Ceva-Waves UWB IP not only improves range and throughput but also maintains power efficiency, supporting a variety of Physical AI applications from autonomous robots to smart factories, driving the development of intelligent edge products.
- Technological Innovation: Ceva's Ceva-Waves UWB IP is the industry's first IEEE 802.15.4ab-compliant UWB IP, delivering up to 30x extended range and 4x faster data rates, significantly enhancing performance for secure access, positioning, and radar applications.
- Market Demand: According to ABI Research, UWB shipments exceeded 563 million units in 2025 and are forecasted to surpass 1.4 billion by 2030, indicating rapid growth potential for UWB technology across consumer, automotive, and industrial markets.
- Ecosystem Compatibility: The Ceva-Waves UWB IP is fully backward compatible with IEEE 802.15.4z while adding support for enhanced sensing and data communications under the new standard, ensuring faster time-to-market for device manufacturers.
- Collaborative Validation: Ceva is working closely with LitePoint for early validation to ensure interoperability and rapid commercialization of IEEE 802.15.4ab, helping customers bring next-generation UWB technology to market more quickly.
- Technological Innovation: Ceva's Ceva-Waves™ UWB IP is the first IEEE 802.15.4ab-compliant UWB IP, delivering up to 30x extended range and 4x higher data rates, significantly enhancing secure access and positioning capabilities across consumer, automotive, and industrial systems.
- Market Demand: According to ABI Research, UWB shipments exceeded 563 million units in 2025 and are forecasted to surpass 1.4 billion units annually by 2030, indicating rapid adoption and application potential across various industries.
- Ecosystem Compatibility: The new IP is fully backward compatible with IEEE 802.15.4z while adding support for enhanced sensing and data communications under the new standard, ensuring device manufacturers can achieve interoperability and faster commercialization.
- Collaborative Validation: Ceva is closely collaborating with LitePoint for early validation to accelerate ecosystem readiness for IEEE 802.15.4ab, ensuring comprehensive testing and measurement solutions that help customers bring next-generation UWB technology to market more quickly.









