Flex Expands Strategic Collaboration with AMD
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Mar 02 2026
0mins
Should l Buy FLEX?
Flex (FLEX) announced the expansion of its strategic collaboration with AMD (AMD) to manufacture the AMD Instinct platform in the United States. As part of the collaboration, manufacturing of AMD Instinct MI355X platform is now underway at Flex's headquarters in Austin, Texas, with volume ramp expected next quarter. The collaboration extends beyond the current generation; Flex will also support the next generation of AMD Instinct platforms to meet surging demand for large-scale AI deployments across data centers. Flex manufactures the complete AMD Instinct platform, assembling eight AMD Instinct GPUs along with surrounding components - including PCIe Gen 5 interfaces, high-bandwidth memory, and high-speed interconnect fabric - into a single, high-density system design.
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Analyst Views on FLEX
Wall Street analysts forecast FLEX stock price to rise
7 Analyst Rating
7 Buy
0 Hold
0 Sell
Strong Buy
Current: 61.640
Low
74.00
Averages
76.71
High
85.00
Current: 61.640
Low
74.00
Averages
76.71
High
85.00
About FLEX
Flex Ltd. is end-to-end manufacturing partner that helps brands design, build, deliver and manage products. Its capabilities include design and engineering, supply chain, manufacturing, post-production and post-sale services, and proprietary products. Its segments include Flex Agility Solutions (FAS) and Flex Reliability Solutions (FRS). The FAS segment consists of various end markets, such as Communications, Enterprise and Cloud, including data infrastructure, edge infrastructure and communications infrastructure; Lifestyle, including appliances, floorcare, smart living and power tools, and Consumer Devices, including mobile and high velocity consumer devices. The FRS segment consists of end markets, such as Automotive, including compute platforms, power electronics, motion, and interface; Health Solutions, including medical devices, medical equipment and drug delivery, and Industrial, including capital equipment, industrial devices, renewables, embedded and critical power.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
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- High-Performance Infrastructure: These reference designs leverage a disaggregated architecture for the 800 VDC power rack developed in collaboration with NVIDIA, maximizing compute space and increasing GPU density, ensuring high performance and low-latency communication in the AI era, thereby enhancing Flex's competitive edge in the AI infrastructure market.
- Global Footprint Advantage: With over 18 million square feet of facilities across the Americas, including Austin, Texas, and Guadalajara, Mexico, Flex can rapidly respond to U.S. data center operators' needs, shortening lead times and further solidifying its market position.
- Forward-Looking Technology Application: By integrating high-capacity power feeds and redundant busway systems, Flex's modular solutions not only enhance the reliability of power delivery but also provide customers with scalable infrastructure to support the growth of future AI workloads.
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- Production Capacity: By closely coordinating silicon design, advanced packaging, and thermal engineering, the collaboration between JetCool and Broadcom establishes a production-ready thermal foundation for hyperscale AI infrastructure, supporting high-volume manufacturing for future AI silicon generations.
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- Modular Solutions Innovation: Flex's new modular designs integrate 800 VDC power racks, high-density IT racks, and advanced liquid cooling systems, aiming to reduce on-site complexity and accelerate AI factory deployment by 30%, significantly enhancing customer market responsiveness.
- High-Performance Infrastructure: These reference designs leverage a disaggregated architecture for the 800 VDC power rack developed in collaboration with NVIDIA, maximizing compute space and increasing GPU density, ensuring high performance and low-latency communication in the AI era, thereby enhancing Flex's competitive edge in the AI infrastructure market.
- Global Footprint Advantage: With over 18 million square feet of facilities across the Americas, including Austin, Texas, and Guadalajara, Mexico, Flex can rapidly respond to U.S. data center operators' needs, shortening lead times and further solidifying its market position.
- Forward-Looking Technology Application: By integrating high-capacity power feeds and redundant busway systems, Flex's modular solutions not only enhance the reliability of power delivery but also provide customers with scalable infrastructure to support the growth of future AI workloads.
See More
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- Share Increase: Blue Door Asset Management acquired an additional 88,100 shares of NICE in Q4 2025, with an estimated transaction value of $10.64 million, indicating confidence in the company's future growth prospects.
- Value Growth: The value of NICE's position at quarter-end rose by $8.22 million, reflecting both the addition of shares and price appreciation, showcasing the company's robust performance in the market.
- Financial Performance: NICE generated $2.95 billion in revenue for 2025, an 8% year-over-year increase, with its cloud segment growing 13% to $2.24 billion, highlighting strong demand in the digital transformation space.
- Market Performance: Despite a 16.5% decline in NICE's stock price over the past year, shares have risen about 4% at the start of 2026, demonstrating investor recognition of its long-term value.
See More
Broadcom Launches New AI Networking Chip
- Chip Launch: Broadcom's Tomahawk 6 networking chip has entered full production, enabling unprecedented data handling capabilities that support large data centers in running AI systems more efficiently, which is expected to significantly enhance clients' computational power and data processing speeds.
- Revenue Forecast Upgrade: Analysts anticipate Broadcom's revenue for the April quarter to reach $21 billion to $22 billion, with AI revenue potentially hitting $10 billion to $11 billion, indicating strong growth potential for the company in the AI sector.
- New Technology Introduction: The new technologies introduced by Broadcom aim to enhance the efficiency of large AI data centers by accelerating data transfer, reducing power consumption, and improving reliability, with plans to showcase these innovations at the Optical Fiber Communications Conference in 2026.
- Industry Collaboration: Broadcom is collaborating with industry partners to develop the Optical Compute Interconnect agreement, which aims to facilitate seamless connectivity between different devices, with demonstrations of technologies alongside over 30 partners planned for the 2026 Optical Fiber Communications Conference, further promoting standardization in AI infrastructure.
See More
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- New Chip Launch: Broadcom has introduced the Taurus BCM83640 chip, which supports 1.6-terabit data modules, effectively doubling network capacity in data centers to meet the rising traffic demands of AI applications.
- Cooling Technology Partnership: In collaboration with JetCool and Flex, Broadcom is developing a cooling system that delivers liquid directly to chips to manage the heat generated by powerful AI processors, ensuring efficient operation of data centers.
- Strong Earnings Report: Broadcom reported fiscal Q1 revenue of $19.31 billion, a 29% year-over-year increase, with AI-related revenue soaring 106% to $8.4 billion, indicating robust market demand and driving stock price gains.
- Analyst Upbeat Outlook: Several analysts have raised their price targets for Broadcom, with JPMorgan increasing its target from $475 to $500 and Goldman Sachs from $450 to $480, reflecting confidence in Broadcom's future growth prospects.
See More
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- Collaboration Background: JetCool has partnered with Broadcom to deliver liquid cooling solutions for next-generation AI XPUs, leveraging Flex's global production capabilities to meet the increasing demands of AI training and inference workloads.
- Technological Innovation: The newly developed single-phase direct-to-chip cooling solution achieves heat flux levels of 4 W/mm² per device, ensuring sustained multi-kilowatt performance for high-density ASIC platforms, thereby enhancing system performance and reliability.
- Production Capacity: By closely coordinating silicon design, advanced packaging, and thermal engineering, the collaboration between JetCool and Broadcom establishes a production-ready thermal foundation for hyperscale AI infrastructure, supporting high-volume manufacturing for future AI silicon generations.
- Market Outlook: JetCool's liquid cooling infrastructure, combined with Flex's global manufacturing capabilities, will drive the advancement of high-performance direct-to-chip thermal architectures, addressing the needs of high-density silicon architectures for future AI platforms and enhancing competitive positioning in the market.
See More
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- Collaboration Announcement: JetCool collaborates with Broadcom to develop innovative liquid cooling solutions.
- Focus on AI: The partnership aims to enhance next-generation AI applications through advanced cooling technologies.
See More
