MACOM and Semtech Form Active Copper Cable Multi-Source Agreement

Thirteen global leaders in networking, semiconductors and cabling have joined forces to form the Active Copper Cable Multi-Source Agreement. This consortium is committed to defining specifications that will enable a robust ecosystem of interoperable ACC solutions, addressing one of the industry's biggest challenges: reducing power, cost and latency while enhancing the performance of high speed copper interconnect. Co-chaired by MACOM (MTSI) and Semtech (ASMTC), founding members include: AMD (AMD), Amphenol (APH), Ciena (CIEN), Cisco (CSCO), Dell Technologies (DELL), Keysight Technologies (KEYS), Luxshare Technologies, MACOM Technology Solutions, Molex, Multilane, NVIDIA (NVDA), Semtech Corporation and TE Connectivity (TEL). The initial focus of the ACC-MSA is on optimized copper interconnect featuring integrated linear equalizers. The MSA specifications will define the electrical, firmware and testing requirements to ensure seamless interoperability across multiple vendors of networking equipment and copper cables. "Extending the reach of copper cabling is critical for scaling intra-rack connectivity for AI and other high-performance applications," said Marek Tlaka, Vice President, High Performance Connectivity at MACOM. "Through the integration of linear equalizers within cable connectors, we can significantly increase copper's reach, reduce cable thickness and deliver lower power consumption and latency compared to DSP-based solutions, while maintaining low bit error rate and a pluggable interface compatible with existing passive copper and optical interconnects."