IBM and Lam Research Collaborate on Sub-1nm Logic Scaling
Written by Emily J. Thompson, Senior Investment Analyst
Updated: 1 hour ago
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Should l Buy IBM?
Source: seekingalpha
- Collaboration Agreement: IBM and Lam Research have signed a five-year collaboration agreement aimed at jointly developing new materials and processes to support logic scaling to the sub-1nm node, marking a significant advancement in their semiconductor partnership.
- Technological Innovation Focus: The collaboration will concentrate on developing advanced etch and deposition capabilities, as well as High NA EUV lithography processes, to meet the demands of increasingly complex device architectures, thereby accelerating industry adoption of next-generation interconnect and device patterning.
- Decade of Partnership: IBM and Lam Research have collaborated for over a decade to advance logic fabrication technologies, successfully enabling early applications of 7nm, nanosheet, and EUV process technologies, which lays a solid foundation for this new agreement.
- Combining Research Capabilities: By leveraging IBM's advanced research capabilities at the Albany NanoTech Complex alongside Lam's end-to-end process tools and innovations, the teams will build and validate complete process flows for nanosheet and nanostack devices, ensuring reliable transfer of High-NA EUV patterns into actual device layers with high yield.
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Analyst Views on IBM
Wall Street analysts forecast IBM stock price to rise
16 Analyst Rating
11 Buy
4 Hold
1 Sell
Moderate Buy
Current: 253.330
Low
210.00
Averages
315.80
High
375.00
Current: 253.330
Low
210.00
Averages
315.80
High
375.00
About IBM
International Business Machines Corporation is a provider of global hybrid cloud and artificial intelligence (AI) and consulting expertise. The Company’s segments include Software, Consulting, Infrastructure and Financing. The Software segment includes hybrid cloud and AI platforms, which allow clients to realize their digital and AI transformations across the applications, data, and environments in which they operate. The Consulting segment focuses on integrating skills on strategy, experience, technology and operations by domain and industry. The Infrastructure segment is focused on the hybrid cloud infrastructure market, providing on-premises and cloud-based server and storage solutions. In addition, it offers a portfolio of life-cycle services for hybrid cloud infrastructure deployment. The Financing segment provides client and commercial financing, facilitating its clients’ acquisition of hardware, software and services. It helps clients in more than 175 countries.
About the author

Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
- Collaboration Agreement: IBM and Lam Research have signed a five-year collaboration agreement aimed at jointly developing new materials and processes to support logic scaling to the sub-1nm node, marking a significant advancement in their semiconductor partnership.
- Technological Innovation Focus: The collaboration will concentrate on developing advanced etch and deposition capabilities, as well as High NA EUV lithography processes, to meet the demands of increasingly complex device architectures, thereby accelerating industry adoption of next-generation interconnect and device patterning.
- Decade of Partnership: IBM and Lam Research have collaborated for over a decade to advance logic fabrication technologies, successfully enabling early applications of 7nm, nanosheet, and EUV process technologies, which lays a solid foundation for this new agreement.
- Combining Research Capabilities: By leveraging IBM's advanced research capabilities at the Albany NanoTech Complex alongside Lam's end-to-end process tools and innovations, the teams will build and validate complete process flows for nanosheet and nanostack devices, ensuring reliable transfer of High-NA EUV patterns into actual device layers with high yield.
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