HyperLight Collaborates with Jabil to Accelerate Photonics Deployment
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Mar 13 2026
0mins
HyperLight, UMC (UMC), and Wavetek, a wholly owned subsidiary of UMC, announced a collaboration with Jabil (JBL), to accelerate the deployment of thin-film lithium niobate photonics into hyperscale AI data center interconnects. The collaboration brings together HyperLight's TFLN photonic technology, UMC and Wavetek's qualified foundry manufacturing, and Jabil's expertise in high-volume manufacturing and assembly to support deployment of next-generation optical modules at data-center scale. HyperLight and Jabil have worked closely to integrate TFLN-based photonic devices into next-generation optical transceiver platforms.
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Analyst Views on UMC
Wall Street analysts forecast UMC stock price to fall
2 Analyst Rating
0 Buy
0 Hold
2 Sell
Moderate Sell
Current: 8.870
Low
4.80
Averages
5.50
High
6.20
Current: 8.870
Low
4.80
Averages
5.50
High
6.20
About UMC
United Microelectronics Corp is a global semiconductor foundry. The Company provides integrated circuit (IC) production for applications spanning every sector of the electronics industry. The Company operates through two segments. The Wafer Fabrication segment is mainly engaged in the manufacture of chips to the design specifications of its customers by using its own processes and techniques. The New Business segment is engaged in the research, development, manufacture and provision of solar energy. The Company is engaged in the maintenance of a customer base across various industries, including communication, consumer electronics, computer, memory, new generation light-emitting diode (LED) and others, while focusing on manufacturing for applications, including networking, telecommunications, Internet, multimedia, personal computers (PCs) and graphics.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
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- Quarterly Revenue Performance: Despite a slight dip in market share to 70.4% in Q4 2025, quarterly revenue still rose 2.0% sequentially to $33.72 billion, indicating strong revenue growth driven by higher average selling prices.
- Industry-Wide Performance: The top ten foundries generated a combined $169.47 billion in sales in 2025, a 26.3% increase year-over-year, highlighting a strong recovery in the industry driven by AI and high-end chip demand, with TSMC solidifying its market leadership.
- Technical Analysis and Price Action: TSMC shares rose 1.29% to $341.07 in premarket trading, although trading 5.6% below the 20-day SMA, the long-term trend remains positive with a 96.23% increase over the past 12 months, nearing 52-week highs.
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- Energy Consumption Advantages: HyperLight's TFLN technology significantly reduces energy consumption in current optical modules, with advantages becoming more pronounced as lane speeds increase, helping data centers optimize power usage while accommodating higher GPU densities and larger clusters.
- System Integration and Reliability: Jabil's expertise in system integration and manufacturing execution, along with UMC's qualified foundry manufacturing, ensures that TFLN-based solutions can be reliably deployed at the data center level, meeting the needs of AI and hyperscale customers and driving the industry towards more efficient photonic technologies.
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- Enhanced Production Capacity: This collaboration leverages UMC's 8-inch production capabilities alongside Wavetek's high-volume manufacturing infrastructure, ensuring the scale required for future AI infrastructure growth, thereby enhancing market competitiveness.
- Technological Innovation: The TFLN Chiplet™ platform unifies the requirements of IMDD, coherent, and co-packaged optics, delivering extremely high modulation bandwidth and ultra-low optical loss, while reducing power consumption and supporting CMOS direct-drive voltage, making it suitable for emerging applications like quantum computing.
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See More
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- Enhanced Manufacturing Capacity: This collaboration leverages UMC's 8-inch production capabilities alongside HyperLight's design to meet future data center demands for 1.6T bandwidth and beyond, thereby establishing a new industry benchmark in the rapidly growing AI and networking infrastructure market.
- Technological Innovation and Market Application: The TFLN Chiplet platform enables extreme high modulation bandwidth and ultralow optical loss, reducing laser consumption and supporting CMOS direct-drive voltage, making it suitable for emerging applications like quantum computing and sensing, thus accelerating the adoption of photonic technologies.
- Global Market Strategy: HyperLight's standardized production architecture will simplify ecosystem complexity, lower manufacturing risks, and facilitate the rapid, cost-competitive adoption of TFLN photonics globally, further solidifying its leadership position in the optical interconnect space.
See More
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- Growing Market Demand: Driven by AI and diverse applications such as networking and automotive, the demand for chip architectures is rising, and UMC has unlocked significant value for customers through successful 3D integration of RFSOI wafers for RF front-end modules in partnership with Adeia.
- Innovation Driving Technology: Adeia's semiconductor IP portfolio includes innovations in hybrid bonding, advanced packaging, and semiconductor processing technologies, which enhance interconnect density, power efficiency, and bandwidth, serving as critical enablers for next-generation logic, memory, and high-performance computing devices.
- Long-term Commitment: Adeia's Chief Revenue Officer, Mark Kokes, stated that this agreement reflects the strength of Adeia's IP portfolio and its commitment to supporting UMC in driving advancements in 3D integration and heterogeneous packaging, highlighting the deep collaboration between the two in semiconductor manufacturing.
See More
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- Market Share Growth: TSMC's foundry market share reached 69.9% in 2025, up from 64.4% in 2024, with projected revenue of $122.54 billion reflecting a 36.1% year-over-year increase, showcasing its robust performance amid surging AI infrastructure demand.
- Quarterly Revenue Performance: Despite a slight dip in market share to 70.4% in Q4 2025, quarterly revenue still rose 2.0% sequentially to $33.72 billion, indicating strong revenue growth driven by higher average selling prices.
- Industry-Wide Performance: The top ten foundries generated a combined $169.47 billion in sales in 2025, a 26.3% increase year-over-year, highlighting a strong recovery in the industry driven by AI and high-end chip demand, with TSMC solidifying its market leadership.
- Technical Analysis and Price Action: TSMC shares rose 1.29% to $341.07 in premarket trading, although trading 5.6% below the 20-day SMA, the long-term trend remains positive with a 96.23% increase over the past 12 months, nearing 52-week highs.
See More
HyperLight, UMC, and Jabil Collaborate to Advance Photonic Technology
- Collaboration Accelerates Photonic Technology: The partnership between HyperLight, UMC, and Jabil aims to expedite the deployment of thin-film lithium niobate (TFLN) photonic technology in hyperscale AI data center interconnects, leveraging each party's technological strengths to drive the rollout of next-generation optical modules that meet the market's high bandwidth demands.
- Enhanced Manufacturing Capabilities: UMC and Wavetek's 6-inch and 8-inch wafer manufacturing capabilities, combined with Jabil's efficient supply chain management, ensure that the TFLN Chiplet™ Platform can achieve rapid adoption in the mass market, thereby improving overall production efficiency and market responsiveness.
- Energy Consumption Advantages: HyperLight's TFLN technology significantly reduces energy consumption in current optical modules, with advantages becoming more pronounced as lane speeds increase, helping data centers optimize power usage while accommodating higher GPU densities and larger clusters.
- System Integration and Reliability: Jabil's expertise in system integration and manufacturing execution, along with UMC's qualified foundry manufacturing, ensures that TFLN-based solutions can be reliably deployed at the data center level, meeting the needs of AI and hyperscale customers and driving the industry towards more efficient photonic technologies.
See More
HYPERLIGHT AND UMC PARTNER WITH JABIL TO INTRODUCE TFLN PHOTONICS FOR DATA CENTER SCALING
- Collaboration Announcement: Hyperlight and Umc have partnered to enhance the deployment of TF-LN photonics at data centers.
- Focus on Scalability: The collaboration aims to scale the implementation of advanced photonic technologies in data center environments.
See More
HyperLight Partners with UMC for TFLN Chiplet Production
- Strategic Manufacturing Partnership: HyperLight has formed a strategic partnership with UMC and its subsidiary Wavetek to focus on high-volume production of the TFLN Chiplet™ platform, marking a significant inflection point in the commercialization of TFLN photonics, which is expected to drive large-scale deployment of AI and cloud infrastructure.
- Enhanced Production Capacity: This collaboration leverages UMC's 8-inch production capabilities alongside Wavetek's high-volume manufacturing infrastructure, ensuring the scale required for future AI infrastructure growth, thereby enhancing market competitiveness.
- Technological Innovation: The TFLN Chiplet™ platform unifies the requirements of IMDD, coherent, and co-packaged optics, delivering extremely high modulation bandwidth and ultra-low optical loss, while reducing power consumption and supporting CMOS direct-drive voltage, making it suitable for emerging applications like quantum computing.
- Broad Market Prospects: HyperLight's standardized production architecture will simplify ecosystem complexity, lower manufacturing risks, and facilitate the rapid, cost-competitive global adoption of TFLN photonics, positioning the company to lead the future development of optical interconnect technologies.
See More
HyperLight and UMC Form Strategic Manufacturing Partnership
- Strategic Partnership: HyperLight has formed a strategic manufacturing partnership with UMC and its subsidiary Wavetek, focusing on high-volume production of the TFLN Chiplet™ platform, marking a significant inflection point in the commercialization of TFLN photonics, which is expected to drive large-scale deployment of AI and cloud infrastructure.
- Enhanced Manufacturing Capacity: This collaboration leverages UMC's 8-inch production capabilities alongside HyperLight's design to meet future data center demands for 1.6T bandwidth and beyond, thereby establishing a new industry benchmark in the rapidly growing AI and networking infrastructure market.
- Technological Innovation and Market Application: The TFLN Chiplet platform enables extreme high modulation bandwidth and ultralow optical loss, reducing laser consumption and supporting CMOS direct-drive voltage, making it suitable for emerging applications like quantum computing and sensing, thus accelerating the adoption of photonic technologies.
- Global Market Strategy: HyperLight's standardized production architecture will simplify ecosystem complexity, lower manufacturing risks, and facilitate the rapid, cost-competitive adoption of TFLN photonics globally, further solidifying its leadership position in the optical interconnect space.
See More
Adeia Renews IP Licensing Agreement with UMC
- IP Collaboration Deepens: Adeia has renewed its intellectual property licensing agreement with UMC, a leading semiconductor foundry, ensuring UMC's continued access to Adeia's semiconductor portfolio, including hybrid bonding technologies, thereby fostering collaboration on future 3D integration and advanced packaging solutions.
- Growing Market Demand: Driven by AI and diverse applications such as networking and automotive, the demand for chip architectures is rising, and UMC has unlocked significant value for customers through successful 3D integration of RFSOI wafers for RF front-end modules in partnership with Adeia.
- Innovation Driving Technology: Adeia's semiconductor IP portfolio includes innovations in hybrid bonding, advanced packaging, and semiconductor processing technologies, which enhance interconnect density, power efficiency, and bandwidth, serving as critical enablers for next-generation logic, memory, and high-performance computing devices.
- Long-term Commitment: Adeia's Chief Revenue Officer, Mark Kokes, stated that this agreement reflects the strength of Adeia's IP portfolio and its commitment to supporting UMC in driving advancements in 3D integration and heterogeneous packaging, highlighting the deep collaboration between the two in semiconductor manufacturing.
See More
