Everspin Enters Strategic Manufacturing Agreement with Microchip Technology
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Apr 08 2026
0mins
Should l Buy MRAM?
Everspin Technologies announced its strategic manufacturing agreement with Microchip Technology to expand production capacity and strengthen long-term supply. Everspin has entered into an initial 10-year agreement, that can be extended in 2-year increments, with Microchip Technology to augment its onshore manufacturing capacity for MRAM and Tunnel Magnetoresistive sensor products. The company will establish a copy exact (plus) MRAM line to manufacture MRAM and TMR sensor products currently produced at its line in Chandler, AZ. "Everspin is expanding its manufacturing footprint to support the next phase of MRAM adoption, as customers look for both long-term supply stability and higher-density, more capable solutions," says Sanjeev Aggarwal, President and CEO. "Our partnership with Microchip adds the production scale to support demand while continuing to advance our MRAM roadmap." Under the agreement, Everspin will stand up its industry leading magnetic technology and manufacturing process at a Microchip fabrication facility in Oregon. Everspin will retain ownership of the intellectual property and manufacturing process while utilizing Microchip's foundry services capacity. This expanded capacity will leverage Everspin's strong balance sheet and partnerships.
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Analyst Views on MRAM
Wall Street analysts forecast MRAM stock price to rise
1 Analyst Rating
1 Buy
0 Hold
0 Sell
Moderate Buy
Current: 12.370
Low
8.00
Averages
High
8.00
Current: 12.370
Low
8.00
Averages
High
8.00
About MRAM
Everspin Technologies, Inc. is a developer and manufacturer of magnetoresistive random access memory (MRAM) solutions. Its portfolio of MRAM technologies includes Toggle MRAM, Tunnel Magneto Resistance (TMR) Sensors, and Spin-transfer Torque MRAM (STT-MRAM). Toggle MRAM products are designed to address applications in the industrial, medical, automotive/transportation, and data center markets. It offers these products with industry standard interfaces, including Parallel, Serial Peripheral Interface (SPI) and Quad SPI (QSPI) interfaces. STT-MRAM technology can be tuned to deliver products in Dynamic Random Access Memory (DRAM), Static Random Access Memory (SRAM) and NOR Flash applications. TMR sensors provide high magnetic sensitivity in a single component that performs 3D magnetic field measurements in a monolithic solution. It sells its products directly and through its distribution channels, to original equipment manufacturers (OEMs) and original design manufacturers (ODMs).
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
Everspin Technologies Partners with Microchip to Expand MRAM Production
- Strategic Manufacturing Agreement: Everspin Technologies has signed a 10-year strategic manufacturing agreement with Microchip Technology aimed at enhancing production capacity for MRAM and Tunnel Magnetoresistive (TMR) sensor products, thereby ensuring long-term supply chain stability.
- Capacity Expansion: The agreement will establish a copy exact (plus) MRAM line to augment Everspin's existing production capabilities in Chandler, Arizona, which is expected to significantly increase output to meet market demand.
- Flexible Terms: The agreement allows for extensions in 2-year increments after the initial 10-year term, providing Everspin with the flexibility to adjust production plans dynamically based on market changes and demand, thereby enhancing its market adaptability.
- Positive Market Outlook: With the growing demand for MRAM and TMR sensor products, this collaboration not only strengthens Everspin's competitive position in the market but also has the potential to drive future revenue growth and profitability.
See More
EVERSPIN TECHNOLOGIES INC SIGNS 10-YEAR AGREEMENT WITH MICROCHIP TO BOOST ONSHORE MANUFACTURING, WITH OPTIONS FOR 2-YEAR EXTENSIONS
Partnership Announcement: EverSpin Technologies has entered into a 10-year agreement with Microchip for augmenting manufacturing capabilities onshore.
Potential for Extension: The agreement includes provisions for potential two-year increments to extend the partnership further.
See More
EVERSPIN TECHNOLOGIES INC - UNVEILS STRATEGIC MANUFACTURING PARTNERSHIP WITH MICROCHIP TECHNOLOGY
Strategic Manufacturing Agreement: EverSpin Technologies has announced a strategic manufacturing agreement with Microchip Technology to enhance production capabilities.
Focus on Spintronics: The partnership aims to leverage advancements in spintronics technology, which is crucial for developing next-generation memory solutions.
See More
Everspin Launches UNISYST MRAM Architecture for Edge AI
- New Architecture Launch: Everspin Technologies has introduced the UNISYST MRAM architecture, designed to unify code storage and data memory, addressing the physical and performance limitations faced by embedded systems, thereby enhancing design flexibility and efficiency.
- High-Density Storage: The UNISYST family will initially offer storage densities ranging from 128 megabits to 2 gigabits, utilizing a standard xSPI interface that supports up to 200MHz octal SPI, significantly improving data transfer speeds to meet high bandwidth and endurance requirements.
- Market Expansion Potential: By applying MRAM technology across edge AI, military aerospace, automotive, and industrial sectors, Everspin not only strengthens its competitive position in the non-volatile memory market but also lays the groundwork for future multi-billion-dollar opportunities.
- Future Development Plans: Engineering samples of UNISYST are expected to be available in Q4 2026, with a formal launch at Embedded World 2026, showcasing its potential to simplify system design and enhance platform performance.
See More
Everspin Completes Production Qualification for 64Mb STT-MRAM
- Production Qualification Completed: Everspin Technologies announced that its 64Mb xSPI STT-MRAM has completed full production qualification for the AEC-Q100 Grade 1 specification, now available for customer orders and supporting high-volume production programs, enhancing the company's competitive edge in the high-reliability memory market.
- New Product Expansion: The company is advancing the production qualification of its 128Mb and 256Mb xSPI STT-MRAM, with the 128Mb expected to complete in May 2026 and the 256Mb in July 2026, further enriching the product line to meet customer demands for high-capacity persistent memory.
- Execution of Technology Roadmap: Everspin's CEO Sanjeev Aggarwal stated that the expansion of the high-reliability product family reflects steady progress against the company's technology roadmap, aiming to provide validated memory solutions for customers designing long-lifecycle systems.
- Market Demand Response: With increasing demand for high-reliability memory solutions, Everspin's portfolio offers scalable options for critical applications in aerospace, defense, and industrial sectors, ensuring data integrity and endurance in extreme environments.
See More
Everspin Completes Production Qualification for 64Mb STT-MRAM
- Production Qualification Completed: Everspin Technologies announced that its 64Mb xSPI STT-MRAM has completed production qualification for the AEC-Q100 Grade 1 specification, now available for customer orders, supporting high-volume production programs and enhancing its competitive position in the high-reliability memory market.
- Product Expansion Plans: Everspin is advancing the production qualification of its 128Mb and 256Mb xSPI STT-MRAM, with the 128Mb expected to complete in May 2026 and the 256Mb scheduled for July 2026, further enriching its high-reliability product portfolio to meet customer demands for higher storage densities.
- Execution of Technology Roadmap: Everspin's CEO Sanjeev Aggarwal stated that the expansion of the PERSYST platform to support a wider range of storage densities reflects ongoing progress against the company's technology roadmap, aimed at meeting the needs of long-lifecycle systems and enhancing product market adaptability.
- Critical Application Areas: These milestones signify Everspin's continued expansion of its HR MRAM portfolio for aerospace, defense, automotive, and industrial applications, addressing stringent requirements for data persistence and reliability.
See More
Everspin Technologies Partners with Microchip to Expand MRAM Production
- Strategic Manufacturing Agreement: Everspin Technologies has signed a 10-year strategic manufacturing agreement with Microchip Technology aimed at enhancing production capacity for MRAM and Tunnel Magnetoresistive (TMR) sensor products, thereby ensuring long-term supply chain stability.
- Capacity Expansion: The agreement will establish a copy exact (plus) MRAM line to augment Everspin's existing production capabilities in Chandler, Arizona, which is expected to significantly increase output to meet market demand.
- Flexible Terms: The agreement allows for extensions in 2-year increments after the initial 10-year term, providing Everspin with the flexibility to adjust production plans dynamically based on market changes and demand, thereby enhancing its market adaptability.
- Positive Market Outlook: With the growing demand for MRAM and TMR sensor products, this collaboration not only strengthens Everspin's competitive position in the market but also has the potential to drive future revenue growth and profitability.
See More
EVERSPIN TECHNOLOGIES INC SIGNS 10-YEAR AGREEMENT WITH MICROCHIP TO BOOST ONSHORE MANUFACTURING, WITH OPTIONS FOR 2-YEAR EXTENSIONS
Partnership Announcement: EverSpin Technologies has entered into a 10-year agreement with Microchip for augmenting manufacturing capabilities onshore.
Potential for Extension: The agreement includes provisions for potential two-year increments to extend the partnership further.
See More
EVERSPIN TECHNOLOGIES INC - UNVEILS STRATEGIC MANUFACTURING PARTNERSHIP WITH MICROCHIP TECHNOLOGY
Strategic Manufacturing Agreement: EverSpin Technologies has announced a strategic manufacturing agreement with Microchip Technology to enhance production capabilities.
Focus on Spintronics: The partnership aims to leverage advancements in spintronics technology, which is crucial for developing next-generation memory solutions.
See More
Everspin Launches UNISYST MRAM Architecture for Edge AI
- New Architecture Launch: Everspin Technologies has introduced the UNISYST MRAM architecture, designed to unify code storage and data memory, addressing the physical and performance limitations faced by embedded systems, thereby enhancing design flexibility and efficiency.
- High-Density Storage: The UNISYST family will initially offer storage densities ranging from 128 megabits to 2 gigabits, utilizing a standard xSPI interface that supports up to 200MHz octal SPI, significantly improving data transfer speeds to meet high bandwidth and endurance requirements.
- Market Expansion Potential: By applying MRAM technology across edge AI, military aerospace, automotive, and industrial sectors, Everspin not only strengthens its competitive position in the non-volatile memory market but also lays the groundwork for future multi-billion-dollar opportunities.
- Future Development Plans: Engineering samples of UNISYST are expected to be available in Q4 2026, with a formal launch at Embedded World 2026, showcasing its potential to simplify system design and enhance platform performance.
See More
Everspin Completes Production Qualification for 64Mb STT-MRAM
- Production Qualification Completed: Everspin Technologies announced that its 64Mb xSPI STT-MRAM has completed full production qualification for the AEC-Q100 Grade 1 specification, now available for customer orders and supporting high-volume production programs, enhancing the company's competitive edge in the high-reliability memory market.
- New Product Expansion: The company is advancing the production qualification of its 128Mb and 256Mb xSPI STT-MRAM, with the 128Mb expected to complete in May 2026 and the 256Mb in July 2026, further enriching the product line to meet customer demands for high-capacity persistent memory.
- Execution of Technology Roadmap: Everspin's CEO Sanjeev Aggarwal stated that the expansion of the high-reliability product family reflects steady progress against the company's technology roadmap, aiming to provide validated memory solutions for customers designing long-lifecycle systems.
- Market Demand Response: With increasing demand for high-reliability memory solutions, Everspin's portfolio offers scalable options for critical applications in aerospace, defense, and industrial sectors, ensuring data integrity and endurance in extreme environments.
See More
Everspin Completes Production Qualification for 64Mb STT-MRAM
- Production Qualification Completed: Everspin Technologies announced that its 64Mb xSPI STT-MRAM has completed production qualification for the AEC-Q100 Grade 1 specification, now available for customer orders, supporting high-volume production programs and enhancing its competitive position in the high-reliability memory market.
- Product Expansion Plans: Everspin is advancing the production qualification of its 128Mb and 256Mb xSPI STT-MRAM, with the 128Mb expected to complete in May 2026 and the 256Mb scheduled for July 2026, further enriching its high-reliability product portfolio to meet customer demands for higher storage densities.
- Execution of Technology Roadmap: Everspin's CEO Sanjeev Aggarwal stated that the expansion of the PERSYST platform to support a wider range of storage densities reflects ongoing progress against the company's technology roadmap, aimed at meeting the needs of long-lifecycle systems and enhancing product market adaptability.
- Critical Application Areas: These milestones signify Everspin's continued expansion of its HR MRAM portfolio for aerospace, defense, automotive, and industrial applications, addressing stringent requirements for data persistence and reliability.
See More
