Amkor Technology Expands Semiconductor Packaging Capacity
Written by Emily J. Thompson, Senior Investment Analyst
Updated: May 20 2026
0mins
Source: Newsfilter
- Investment Expansion: Amkor Technology continues to invest in its Arizona manufacturing footprint by securing an additional 67 acres to support future semiconductor packaging and testing capabilities, aiming to meet the rising market demand and enhance strategic flexibility.
- Innovation Hub: The 104-acre campus located within Peoria's Innovation Core is set to become the first high-volume advanced packaging OSAT facility in the United States, expected to drive demand growth across markets such as artificial intelligence, high-performance computing, and automotive, thereby enhancing the company's competitive position.
- Global Supply Chain Resilience: CEO Kevin Engel stated that this investment not only strengthens the company's capabilities in advanced packaging and testing solutions but also contributes to the resilience of the global supply chain, ensuring customer needs are met effectively.
- Industry Leadership: As the world's largest U.S.-headquartered OSAT, Amkor Technology is committed to delivering high-quality semiconductor solutions for smartphones, data centers, and wearables, leveraging its innovation track record and broad geographic footprint to further solidify its leadership in the industry.
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Analyst Views on AMKR
Wall Street analysts forecast AMKR stock price to fall
7 Analyst Rating
2 Buy
5 Hold
0 Sell
Moderate Buy
Current: 70.580
Low
43.00
Averages
51.83
High
65.00
Current: 70.580
Low
43.00
Averages
51.83
High
65.00
About AMKR
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
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- Industry Comparison: Compared to other firms, Clover Health's profitability is weaker, particularly in the healthcare investment sector, which may lead to a decline in investor confidence regarding its long-term growth potential.
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See More
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- Construction Progress: Construction of the new factory began in April this year in an industrial park 60 kilometers north of Hanoi, with operations expected to start in November 2027, marking Samsung's first chip testing facility in Vietnam and further solidifying its position in the global semiconductor supply chain.
- Capacity Planning: The plant is projected to have an annual capacity of 153.3 billion gigabits (Gb) of dynamic random-access memory (DRAM) chips and 255.6 billion Gb of NAND memory chips, highlighting the urgent market demand for diverse products despite these mature chips being less critical for AI supply chains.
- Future Expansion: The investment was approved by Vietnamese authorities in March, and Samsung intends to reinvest profits from the project, if any, up to about $2.5 billion for a potential second factory, indicating a long-term commitment and expansion strategy in the Vietnamese market.
See More
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- Land Expansion Plan: Amkor Technology has secured an additional 67 acres in Arizona, planning to start production in 2028 at a new campus adjacent to a 104-acre site, indicating its intent to expand in the semiconductor packaging sector to meet growing market demand.
- Technology Upgrade Transition: Amkor is transitioning from traditional simple chip packaging to more advanced technologies through a partnership with TSMC, aiming to enhance its competitiveness and strengthen its position in the high-end market.
- Customer Integration Strategy: CEO Kevin Engel stated that the company is working more closely with clients like AMD, enhancing service value and moving up the value chain, which aims to improve overall profitability.
- Revenue Forecast Adjustment: Amkor expects revenues between $8.5 billion and $9.5 billion by 2028, with sales reaching $11 billion by 2030; however, the midpoint of the 2028 forecast is slightly below analyst expectations, resulting in a 2.6% decline in stock price.
See More
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- EPS and Gross Margin: The company anticipates an EPS of $2.50, plus or minus $0.25, and a gross margin of 17.5%, plus or minus 100 basis points, reflecting challenges in enhancing profitability during the transition to higher-value packaging.
- 2030 Outlook: Amkor expects revenues to exceed $11 billion and EPS to surpass $5 by 2030, with gross margins projected to be over 22%, suggesting optimism for future growth, albeit with initial construction cost pressures.
- Key Assumptions: The company highlights that key assumptions for future growth include a shift towards higher-value packaging, ramp-up costs associated with the Arizona facility, and accelerating revenue growth from 2029 to 2030, all of which will directly impact its long-term strategic planning.
See More
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- Nasdaq Closing Ceremony: On the same day, Amkor will participate in the Nasdaq Closing Bell ceremony, marking this significant occasion to celebrate the company's achievements and strategic momentum, thereby enhancing its brand image and market recognition.
- Executive Team Presentations: The Investor Day will feature presentations from CEO Kevin Engel and CFO Megan Faust, who will discuss key growth initiatives and future financial expectations, showcasing the company's leadership position in the semiconductor industry.
- Live Webcast Availability: Amkor will provide a live video webcast of the Investor Day presentations along with replays on its Investor Relations website, ensuring global investors can access the latest updates and enhancing transparency and communication efficiency.
See More
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- Strategic Expansion: Amkor Technology has secured an additional 67-acre parcel adjacent to its upcoming Peoria campus, aimed at scaling future high-volume semiconductor packaging and testing capacity to meet surging market demand.
- Innovation Core Positioning: This expansion positions the 104-acre Peoria Innovation Core to become the first high-volume, advanced packaging outsourced semiconductor assembly and test (OSAT) facility in the United States, further solidifying the company's market leadership.
- Market Demand Response: The new facility will enhance Amkor's ability to serve the booming demand for advanced semiconductor solutions across artificial intelligence, high-performance computing, automotive, and communications sectors, ensuring the company maintains a competitive edge in a rapidly evolving market.
- Global Supply Chain Resilience: CEO Kevin Engel stated that the continued expansion strengthens the company's capacity to provide leading-edge packaging and test solutions while contributing to a more resilient global supply chain, ensuring long-term sustainable growth.
See More
