AVGO.O News & Events

Broadcom announced that the Tomahawk 6 family switch series is now shipping in production volume

Broadcom announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus BCM83640, optimized for 1.6T transceiver solutions with unprecedented bandwidth density and efficiency. The device features 400G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost effectively deliver low power 1.6T pluggable modules to meet the growing bandwidth needs for AI data centers.

JetCool, a Flex (FLEX) company and a provider of end-to-end liquid cooling solutions for high-density compute, announced it has collaborated with Broadcom (AVGO) to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm per device. By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and JetCool are enabling AI platforms engineered for performance and repeatable manufacturing. Combining JetCool's direct-to-chip liquid cooling, Flex's global manufacturing scale, and Broadcom's custom AI silicon expertise, the partnership establishes a production-ready thermal foundation for hyperscale AI infrastructure.