JetCool Partners with Broadcom for Liquid Cooling Solutions
JetCool, a Flex (FLEX) company and a provider of end-to-end liquid cooling solutions for high-density compute, announced it has collaborated with Broadcom (AVGO) to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm per device. By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and JetCool are enabling AI platforms engineered for performance and repeatable manufacturing. Combining JetCool's direct-to-chip liquid cooling, Flex's global manufacturing scale, and Broadcom's custom AI silicon expertise, the partnership establishes a production-ready thermal foundation for hyperscale AI infrastructure.
Trade with 70% Backtested Accuracy
Analyst Views on FLEX
About FLEX
About the author

- Chip Launch: Broadcom's Tomahawk 6 networking chip has entered full production, enabling unprecedented data handling capabilities that support large data centers in running AI systems more efficiently, which is expected to significantly enhance clients' computational power and data processing speeds.
- Revenue Forecast Upgrade: Analysts anticipate Broadcom's revenue for the April quarter to reach $21 billion to $22 billion, with AI revenue potentially hitting $10 billion to $11 billion, indicating strong growth potential for the company in the AI sector.
- New Technology Introduction: The new technologies introduced by Broadcom aim to enhance the efficiency of large AI data centers by accelerating data transfer, reducing power consumption, and improving reliability, with plans to showcase these innovations at the Optical Fiber Communications Conference in 2026.
- Industry Collaboration: Broadcom is collaborating with industry partners to develop the Optical Compute Interconnect agreement, which aims to facilitate seamless connectivity between different devices, with demonstrations of technologies alongside over 30 partners planned for the 2026 Optical Fiber Communications Conference, further promoting standardization in AI infrastructure.
- New Chip Launch: Broadcom has introduced the Taurus BCM83640 chip, which supports 1.6-terabit data modules, effectively doubling network capacity in data centers to meet the rising traffic demands of AI applications.
- Cooling Technology Partnership: In collaboration with JetCool and Flex, Broadcom is developing a cooling system that delivers liquid directly to chips to manage the heat generated by powerful AI processors, ensuring efficient operation of data centers.
- Strong Earnings Report: Broadcom reported fiscal Q1 revenue of $19.31 billion, a 29% year-over-year increase, with AI-related revenue soaring 106% to $8.4 billion, indicating robust market demand and driving stock price gains.
- Analyst Upbeat Outlook: Several analysts have raised their price targets for Broadcom, with JPMorgan increasing its target from $475 to $500 and Goldman Sachs from $450 to $480, reflecting confidence in Broadcom's future growth prospects.
- Collaboration Background: JetCool has partnered with Broadcom to deliver liquid cooling solutions for next-generation AI XPUs, leveraging Flex's global production capabilities to meet the increasing demands of AI training and inference workloads.
- Technological Innovation: The newly developed single-phase direct-to-chip cooling solution achieves heat flux levels of 4 W/mm² per device, ensuring sustained multi-kilowatt performance for high-density ASIC platforms, thereby enhancing system performance and reliability.
- Production Capacity: By closely coordinating silicon design, advanced packaging, and thermal engineering, the collaboration between JetCool and Broadcom establishes a production-ready thermal foundation for hyperscale AI infrastructure, supporting high-volume manufacturing for future AI silicon generations.
- Market Outlook: JetCool's liquid cooling infrastructure, combined with Flex's global manufacturing capabilities, will drive the advancement of high-performance direct-to-chip thermal architectures, addressing the needs of high-density silicon architectures for future AI platforms and enhancing competitive positioning in the market.

- Collaboration Announcement: JetCool collaborates with Broadcom to develop innovative liquid cooling solutions.
- Focus on AI: The partnership aims to enhance next-generation AI applications through advanced cooling technologies.
- Momentum Score Increase: AMD's momentum score rose from 88.93 to 90.84, placing it in the top 10% of the market, indicating steady progress in securing critical infrastructure and product milestones despite broader sector volatility.
- Robust Fundamentals: While the stock is down 7.26% year-to-date, AMD boasts an impressive quality score of 93.86, reflecting superior operational efficiency and financial health compared to peers, which bolsters investor confidence.
- AI Capacity Expansion: AMD recently launched the Ryzen AI 400 Series, the world's first desktop processors designed for Copilot+ experiences, marking a significant advancement in the company's artificial intelligence capabilities and expected to drive future market demand.
- Stock Price Analysis: Despite a 7.26% decline year-to-date, AMD's stock has risen 22.36% over the past six months and 98.90% over the year, indicating a positive long-term trend, although it faces some short-term pressures.
- Collaborative Manufacturing Opportunity: Flex has initiated U.S.-based production of AMD's Instinct MI355X GPU platforms at its Austin, Texas facility, with a volume ramp expected next quarter to meet the growing demand for AI in data centers.
- Technical Validation and Testing: The partnership involves assembling eight AMD Instinct GPUs and essential components into a high-density system design, which will undergo rigorous testing and validation, thereby reinforcing Flex's manufacturing position in advanced AI infrastructure.
- Market Performance Analysis: Flex shares are currently priced at $64.02, trading 4.5% below the 20-day simple moving average, indicating a bearish trend in the short term, yet the stock has increased approximately 25% over the past 12 months, suggesting long-term growth potential.
- Future Earnings Outlook: Flex is set to report earnings on May 6, 2026, with an estimated EPS of $0.83 and projected revenue of $6.93 billion, reflecting strong growth expectations in the AI sector.










