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The earnings call indicates strong revenue growth driven by advanced packaging and nodes, with positive impacts from the Semilab acquisition. Despite some supply chain challenges, the company is set up for significant growth, particularly in advanced packaging. The Q&A highlights a positive outlook for advanced packaging and AI demand, although management was vague on certain details. Overall, the strong financial performance and optimistic guidance suggest a positive stock price movement in the short term.
Revenue for Q4 2025 $267 million, a 22% increase from Q3. Reasons for the increase include strong demand in advanced packaging and specialty devices, particularly in 2.5D packaging business, which doubled compared to Q3.
Full-year revenue for 2025 $1.005 billion, a record for Onto Innovation. This was driven by growth in advanced packaging, specialty devices, and advanced nodes.
Gross margin for Q4 2025 54.6%, an improvement of about 50 basis points from Q3. The improvement was attributed to operational efficiencies and increased revenue.
Operating margin for Q4 2025 25.2%, an increase of 410 basis points from Q3. This was due to higher revenue and better cost management.
Cash generation for Q4 2025 $95 million, a record for the company. This was attributed to strong operational performance and efficient cash management.
Advanced packaging and specialty devices revenue for Q4 2025 Approximately $145 million, representing slightly more than half of total revenue. This was driven by a doubling of sales in the 2.5D packaging business compared to Q3.
Advanced nodes revenue for 2025 $308 million, more than doubling from the previous year. Growth was driven by strong positions in DRAM and logic, with pilot line sales for a new gate-all-around customer contributing to Q4 growth.
Semilab acquisition impact Approximately $9 million of revenue in Q4 2025. The acquisition also contributed to operational synergies and expanded market opportunities.
Cash tax savings from the One Big Beautiful Bill Tax Act $19 million in 2025 and an additional estimated $14 million in 2026. This was due to accelerated expensing of certain R&D costs.
Dragonfly 2D and 3D bump metrology: Volume purchase agreement valued at over $240 million, including over $60 million in systems for 3D bump metrology, extending through 2027.
Next-generation inspection systems: Supporting 4 customer evaluations with positive preliminary feedback on optical performance and throughput.
JetStep systems: Orders received for large panel packaging facility, supporting high-volume applications.
Firefly process control: Adopted for glass and panel fan-out applications, improving yields through process metrology.
Surface charge metrology: First orders received to address residual charge issues in large-format heterogeneous packaging.
Advanced packaging: Revenue grew over 25% sequentially in Q4 2025, with expected growth of over 30% in 2026.
Advanced nodes: Revenue more than doubled in 2025 to $308 million, driven by OCD technology and adoption of Atlas G6 for gate-all-around and HBM4 DRAM.
Power semiconductors: Revenue strong in Q4 2025 but expected to decline by 10% in 2026 due to weakening EV demand and slowing infrastructure spending.
Revenue: Record revenue of $267 million in Q4 2025, with full-year revenue reaching $1.005 billion.
Margins: Gross margin improved to 54.6% in Q4 2025, with operating margin at 25.2%.
Backlog: Nearly doubled over the last 3 months to approximately 2 quarters.
Semilab acquisition: Completed in November 2025 for $445 million in cash and 641,771 shares of common stock.
AI-driven growth: Surge in AI investments expected to drive semiconductor capital equipment spending, with NVIDIA forecasting 40% CAGR for global AI infrastructure over 5 years.
Customer agreements: Volume purchase agreement with HBM customer for Dragonfly metrology through 2027, valued at $240 million.
Operational discipline: Focus on offshoring, scalability, and profitability, along with disciplined forecasting and spending controls.
Power Semiconductor Revenue Decline: Expected to decline around 10% in 2026 due to weakening demand for EVs and slowing infrastructure spending.
Semilab Revenue Decrease: Likely to experience a decrease from original planning as the company pivots from opportunistic sales to longer-term market opportunities.
Tightening Capacity and Lead Times: Working closely with customers and suppliers to manage tightening capacity and gradual extension of lead times, which could impact operations.
Residual Charge on Die: Concerns about residual charge on die causing yield issues when connected to another die in large-format heterogeneous packaging.
AI Infrastructure Growth: NVIDIA forecasts global AI infrastructure to grow at a 40% CAGR over the next 5 years.
Capital Expenditures by Hyperscalers: Forecasted to exceed $600 billion in 2026.
WFE Growth: Analysts project strong WFE growth in the range of 10% to 20% in 2026, depending on cleanroom space availability.
Volume Purchase Agreement: Onto Innovation secured a $240 million agreement with an HBM customer for Dragonfly 2D and 3D bump metrology demand through 2027.
Advanced Packaging Revenue: Expected to grow over 30% in 2026, setting a new revenue record for this market.
Power Semiconductor Revenue: Expected to decline around 10% in 2026 due to weakening EV demand and slowing infrastructure spending.
Advanced Nodes Revenue: Expected growth in 2026 driven by adoption of Atlas G6 for gate-all-around and HBM4 DRAM applications.
Integrated Metrology Expansion: Expanding to include 2 logic customers for leading-edge processes expected to ramp in 2026.
Q1 2026 Revenue: Expected to be in the range of $275 million to $285 million.
Q2 2026 Revenue: Expected to exceed $300 million, representing 12% to 14% core growth in the first half of 2026 compared to the second half of 2025.
Backlog: Nearly doubled over the last 3 months to approximately 2 quarters, supporting strong growth expectations.
Gross Margin Improvement: Expected to improve by approximately 50 basis points in Q1 2026 compared to Q4 2025.
Operating Margins: Expected to improve to approximately 25.5% to 26.5% in Q1 2026.
Earnings Per Share (Q1 2026): Expected to be in the range of $1.26 to $1.36 per share.
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The earnings call indicates strong revenue growth driven by advanced packaging and nodes, with positive impacts from the Semilab acquisition. Despite some supply chain challenges, the company is set up for significant growth, particularly in advanced packaging. The Q&A highlights a positive outlook for advanced packaging and AI demand, although management was vague on certain details. Overall, the strong financial performance and optimistic guidance suggest a positive stock price movement in the short term.
The earnings call summary indicates strong potential for revenue growth driven by AI packaging and advanced nodes, especially in Q4 2025. The acquisition of Semilab is expected to boost earnings and margins, while the region-for-region strategy aims to reduce costs. Although there are temporary margin pressures, guidance suggests recovery and growth. The Q&A section confirms positive trends in AI packaging and advanced nodes, with expected revenue contributions from new technologies. Overall, the positive guidance and strategic initiatives suggest a positive stock price movement.
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