FLEX News & Events

JetCool, a Flex (FLEX) company and a provider of end-to-end liquid cooling solutions for high-density compute, announced it has collaborated with Broadcom (AVGO) to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm per device. By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and JetCool are enabling AI platforms engineered for performance and repeatable manufacturing. Combining JetCool's direct-to-chip liquid cooling, Flex's global manufacturing scale, and Broadcom's custom AI silicon expertise, the partnership establishes a production-ready thermal foundation for hyperscale AI infrastructure.

Flex (FLEX) announced the expansion of its strategic collaboration with AMD (AMD) to manufacture the AMD Instinct platform in the United States. As part of the collaboration, manufacturing of AMD Instinct MI355X platform is now underway at Flex's headquarters in Austin, Texas, with volume ramp expected next quarter. The collaboration extends beyond the current generation; Flex will also support the next generation of AMD Instinct platforms to meet surging demand for large-scale AI deployments across data centers. Flex manufactures the complete AMD Instinct platform, assembling eight AMD Instinct GPUs along with surrounding components - including PCIe Gen 5 interfaces, high-bandwidth memory, and high-speed interconnect fabric - into a single, high-density system design.