Applied Materials Launches New Chipmaking Systems to Enhance 3D Structure Precision
Applied Materials introduced two new chipmaking systems designed to achieve precision processing in increasingly deep and narrow 3D structures. The new deposition and etch systems help chipmakers extend scaling in logic and memory. "As the industry pushes the limits of AI computing, the biggest opportunities are increasingly found in materials engineering," said Prabu Raja, president of the semiconductor products group at Applied Materials. "From transistor structures to memory stacks, chipmakers need new ways to precisely deposit and selectively remove materials in extremely complex 3D architectures. With our latest deposition and selective etch systems, we are delivering differentiated capabilities that help customers overcome critical scaling barriers and accelerate the next wave of innovation in logic and memory."
