LRCX News & Events

BE Semiconductor (BESI) is receiving takeover interest amid rising demand for advanced chip-packaging technology, and is working with Morgan Stanley (MS) to evaluate potential approaches, Reuters' Milana Vinn and Amy-Jo Crowley report. Potential suitors include Lam Research (LRCX), while Applied Materials (AMAT), which already holds a 9% stake, has also been cited as a possible interested party, according to people familiar with the matter.

IBM (IBM) and Lam Research (LRCX) announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High NA EUV lithography processes to advance IBM's logic scaling roadmap. IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1nm node. The work will focus on developing new materials, advanced etch and deposition capabilities for increasingly complex device architectures, and new High NA EUV lithography processes to enable next-generation interconnect and device patterning and accelerate industry adoption.