QuickLogic Partners with Quantum Leap to Enhance Customer Engagement
Written by Emily J. Thompson, Senior Investment Analyst
Updated: 1 hour ago
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Should l Buy QUIK?
Source: Newsfilter
- Partnership Announcement: QuickLogic has appointed Quantum Leap Solutions as an authorized sales representative, aiming to expand customer engagement in strategic markets by leveraging Quantum Leap's extensive experience in semiconductor IP integration and chiplet architectures, thereby enhancing the flexibility and responsiveness of its sales ecosystem.
- Market Demand: Mike Ingster, Founder and CEO of Quantum Leap Solutions, highlighted the increasing customer demand for embedded FPGAs to adapt to evolving application requirements, a trend that aligns closely with QuickLogic's product strategy and is expected to drive market share growth.
- Technical Advantages: QuickLogic's eFPGA Hard IP solutions are designed to reduce development risks and costs while accelerating time to revenue, further strengthening its competitive position in the low-power and application-optimized semiconductor solutions market.
- Strategic Development: By partnering with Quantum Leap, QuickLogic not only reinforces its sales network but also demonstrates its ongoing commitment to customizable silicon solutions and design services, aiming to meet customer demands for flexibility and innovation.
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Analyst Views on QUIK
Wall Street analysts forecast QUIK stock price to fall
3 Analyst Rating
2 Buy
1 Hold
0 Sell
Moderate Buy
Current: 11.790
Low
5.95
Averages
7.98
High
10.00
Current: 11.790
Low
5.95
Averages
7.98
High
10.00
About QUIK
QuickLogic Corporation is a semiconductor company that develops embedded FPGA (eFPGA) intellectual property (IP), discrete FPGAs, and FPGA system-on-chips (SoCs) for a variety of industrial, aerospace and defense, edge, and endpoint artificial intelligence (AI), consumer, and computing applications. Its products include eFPGA IP Licensing business and associated professional services, consisting of the development and integration of eFPGA technology into custom semiconductor solutions. Its silicon products consist of EOS, QuickAI, ArcticLink III, PolarPro3, PolarPro II, PolarPro, and others. Its new products category includes its artificial intelligence/machine learning (AI/ML) Software Platform from its subsidiary company, SensiML, which includes Software-as-a-Service (SaaS) subscriptions for development when deployed in production, and proof-of-concept services. Its mature products include FPGA families named PASIC3 and QuickRAM, as well as programming hardware and design software.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
QuickLogic Partners with Quantum Leap to Enhance Customer Engagement
- Partnership Announcement: QuickLogic has appointed Quantum Leap Solutions as an authorized sales representative to expand customer engagement through its IP and chiplet solutions, enhancing its influence in strategic markets.
- Market Expertise: Quantum Leap Solutions brings extensive experience in supporting semiconductor IP integration and emerging chiplet architectures, aligning closely with QuickLogic's growing focus on customizable silicon solutions and design services.
- Technical Advantages: QuickLogic's eFPGA Hard IP solutions reduce costs, lower development risks, and accelerate revenue growth, addressing customer demands for embedded FPGAs, particularly as application requirements evolve.
- Sales Ecosystem Enhancement: The partnership with Quantum Leap strengthens QuickLogic's sales ecosystem, enabling better support for customers seeking flexible, low-power, and application-optimized semiconductor solutions.
See More
QuickLogic Partners with Quantum Leap to Enhance Customer Engagement
- Partnership Announcement: QuickLogic has appointed Quantum Leap Solutions as an authorized sales representative, aiming to expand customer engagement in strategic markets by leveraging Quantum Leap's extensive experience in semiconductor IP integration and chiplet architectures, thereby enhancing the flexibility and responsiveness of its sales ecosystem.
- Market Demand: Mike Ingster, Founder and CEO of Quantum Leap Solutions, highlighted the increasing customer demand for embedded FPGAs to adapt to evolving application requirements, a trend that aligns closely with QuickLogic's product strategy and is expected to drive market share growth.
- Technical Advantages: QuickLogic's eFPGA Hard IP solutions are designed to reduce development risks and costs while accelerating time to revenue, further strengthening its competitive position in the low-power and application-optimized semiconductor solutions market.
- Strategic Development: By partnering with Quantum Leap, QuickLogic not only reinforces its sales network but also demonstrates its ongoing commitment to customizable silicon solutions and design services, aiming to meet customer demands for flexibility and innovation.
See More
QuickLogic Stock Rises 21.21% Amid Positive Earnings Outlook
- Stock Performance: QuickLogic (QUIK) closed at $11.11, marking a 2.87% increase from the previous day, outperforming the S&P 500's daily loss of 0.11%, indicating strong market performance.
- Monthly Growth: Over the past month, QuickLogic's stock has surged 21.21%, significantly exceeding the Computer and Technology sector's gain of 0.88% and the S&P 500's gain of 0.51%, highlighting its competitive strength in the industry.
- Earnings Expectations: Analysts anticipate QuickLogic's upcoming earnings report to show a loss of $0.06 per share, which represents a year-over-year growth of 14.29%, while revenue is expected to reach $5.5 million, reflecting a 27.31% increase compared to the same quarter last year, showcasing the company's resilience.
- Analyst Ratings: Currently, QuickLogic holds a Zacks Rank of 4 (Sell), with the consensus EPS estimate remaining unchanged over the past month; however, its industry rank places it in the top 39% of over 250 industries, indicating relative strength in the semiconductor sector.
See More
QuickLogic Unveils New RadPro FPGA Development Kit at HEART Conference
- Product Launch: QuickLogic showcases its first RadPro FPGA development kit at the 2026 HEART Conference, fabricated using GlobalFoundries' proven 12nm process technology, aimed at meeting the Defense Industrial Base (DIB) requirements for radiation-hardened ASICs, marking a significant step in the company's radiation-hardened FPGA roadmap.
- Market Demand Response: The company has accepted initial orders for the RadPro development kit in Q1, with shipments expected to commence after the HEART Conference, which not only addresses the urgent market demand for high-performance radiation-hardened solutions but also lays the groundwork for evaluations in long-term defense and aerospace projects.
- Technical Advantages: The RadPro FPGA technology is extensible to eFPGA Hard IP, supporting radiation-hardened ASIC and SoC designs, showcasing QuickLogic's technological prowess in delivering low-power, highly customizable solutions, thereby strengthening its competitive position in the industrial and aerospace markets.
- Industry Standard Tool Support: The new development kit is compatible with Aurora industry-standard FPGA user tools, enhancing DIB evaluation capabilities and enabling customers to transition more effectively into long-term projects, thus increasing QuickLogic's market share in the defense sector.
See More
QuickLogic Secures Mid-Six-Figure Contract for eFPGA Enhancements
- Contract Award: QuickLogic announced a mid-six-figure contract to implement its recently developed eFPGA Hard IP architectural enhancements for a new customer ASIC based on Intel 18A technology, which is expected to significantly boost the company's competitiveness in the high-density FPGA market.
- Technical Advantages: The enhancements lower power consumption, increase performance, and reduce the silicon area required for high-density eFPGA cores, indicating QuickLogic's capability to extend its technology across advanced fabrication nodes, potentially attracting more customer interest.
- Market Reaction: Following the announcement, QuickLogic's shares rose 5% in premarket trading, reflecting investor optimism regarding the company's future growth potential and further bolstering market confidence in its technological innovations.
- Strategic Implications: By collaborating with Intel, QuickLogic not only solidifies its position in the semiconductor industry but also paves the way for future technological partnerships and market expansion, helping the company capture a larger share in the rapidly evolving chip market.
See More
QuickLogic Secures Mid-Six-Figure Contract to Enhance eFPGA Technology
- Contract Signing: QuickLogic Corporation has signed a mid-six-figure contract to implement architectural enhancements for its eFPGA Hard IP, indicating strong market demand and the company's competitive positioning.
- Technical Enhancements: The enhancements lower power consumption, increase performance, and reduce the silicon area (PPA) required for high-density eFPGA cores, allowing QuickLogic to extend its technology applications across advanced fabrication nodes.
- Market Positioning: VP Andy Jaros stated that with significant PPA improvements developed in 2025, QuickLogic is well-positioned to meet the demands for very high-density eFPGA cores and large discrete FPGA requirements, showcasing enhanced market adaptability.
- Expanded Application Scope: By improving responsiveness to cost-sensitive applications, QuickLogic anticipates significantly broadening its market scope and use cases, further solidifying its leadership in the embedded FPGA sector.
See More
QuickLogic Partners with Quantum Leap to Enhance Customer Engagement
- Partnership Announcement: QuickLogic has appointed Quantum Leap Solutions as an authorized sales representative to expand customer engagement through its IP and chiplet solutions, enhancing its influence in strategic markets.
- Market Expertise: Quantum Leap Solutions brings extensive experience in supporting semiconductor IP integration and emerging chiplet architectures, aligning closely with QuickLogic's growing focus on customizable silicon solutions and design services.
- Technical Advantages: QuickLogic's eFPGA Hard IP solutions reduce costs, lower development risks, and accelerate revenue growth, addressing customer demands for embedded FPGAs, particularly as application requirements evolve.
- Sales Ecosystem Enhancement: The partnership with Quantum Leap strengthens QuickLogic's sales ecosystem, enabling better support for customers seeking flexible, low-power, and application-optimized semiconductor solutions.
See More
QuickLogic Partners with Quantum Leap to Enhance Customer Engagement
- Partnership Announcement: QuickLogic has appointed Quantum Leap Solutions as an authorized sales representative, aiming to expand customer engagement in strategic markets by leveraging Quantum Leap's extensive experience in semiconductor IP integration and chiplet architectures, thereby enhancing the flexibility and responsiveness of its sales ecosystem.
- Market Demand: Mike Ingster, Founder and CEO of Quantum Leap Solutions, highlighted the increasing customer demand for embedded FPGAs to adapt to evolving application requirements, a trend that aligns closely with QuickLogic's product strategy and is expected to drive market share growth.
- Technical Advantages: QuickLogic's eFPGA Hard IP solutions are designed to reduce development risks and costs while accelerating time to revenue, further strengthening its competitive position in the low-power and application-optimized semiconductor solutions market.
- Strategic Development: By partnering with Quantum Leap, QuickLogic not only reinforces its sales network but also demonstrates its ongoing commitment to customizable silicon solutions and design services, aiming to meet customer demands for flexibility and innovation.
See More
QuickLogic Stock Rises 21.21% Amid Positive Earnings Outlook
- Stock Performance: QuickLogic (QUIK) closed at $11.11, marking a 2.87% increase from the previous day, outperforming the S&P 500's daily loss of 0.11%, indicating strong market performance.
- Monthly Growth: Over the past month, QuickLogic's stock has surged 21.21%, significantly exceeding the Computer and Technology sector's gain of 0.88% and the S&P 500's gain of 0.51%, highlighting its competitive strength in the industry.
- Earnings Expectations: Analysts anticipate QuickLogic's upcoming earnings report to show a loss of $0.06 per share, which represents a year-over-year growth of 14.29%, while revenue is expected to reach $5.5 million, reflecting a 27.31% increase compared to the same quarter last year, showcasing the company's resilience.
- Analyst Ratings: Currently, QuickLogic holds a Zacks Rank of 4 (Sell), with the consensus EPS estimate remaining unchanged over the past month; however, its industry rank places it in the top 39% of over 250 industries, indicating relative strength in the semiconductor sector.
See More
QuickLogic Unveils New RadPro FPGA Development Kit at HEART Conference
- Product Launch: QuickLogic showcases its first RadPro FPGA development kit at the 2026 HEART Conference, fabricated using GlobalFoundries' proven 12nm process technology, aimed at meeting the Defense Industrial Base (DIB) requirements for radiation-hardened ASICs, marking a significant step in the company's radiation-hardened FPGA roadmap.
- Market Demand Response: The company has accepted initial orders for the RadPro development kit in Q1, with shipments expected to commence after the HEART Conference, which not only addresses the urgent market demand for high-performance radiation-hardened solutions but also lays the groundwork for evaluations in long-term defense and aerospace projects.
- Technical Advantages: The RadPro FPGA technology is extensible to eFPGA Hard IP, supporting radiation-hardened ASIC and SoC designs, showcasing QuickLogic's technological prowess in delivering low-power, highly customizable solutions, thereby strengthening its competitive position in the industrial and aerospace markets.
- Industry Standard Tool Support: The new development kit is compatible with Aurora industry-standard FPGA user tools, enhancing DIB evaluation capabilities and enabling customers to transition more effectively into long-term projects, thus increasing QuickLogic's market share in the defense sector.
See More
QuickLogic Secures Mid-Six-Figure Contract for eFPGA Enhancements
- Contract Award: QuickLogic announced a mid-six-figure contract to implement its recently developed eFPGA Hard IP architectural enhancements for a new customer ASIC based on Intel 18A technology, which is expected to significantly boost the company's competitiveness in the high-density FPGA market.
- Technical Advantages: The enhancements lower power consumption, increase performance, and reduce the silicon area required for high-density eFPGA cores, indicating QuickLogic's capability to extend its technology across advanced fabrication nodes, potentially attracting more customer interest.
- Market Reaction: Following the announcement, QuickLogic's shares rose 5% in premarket trading, reflecting investor optimism regarding the company's future growth potential and further bolstering market confidence in its technological innovations.
- Strategic Implications: By collaborating with Intel, QuickLogic not only solidifies its position in the semiconductor industry but also paves the way for future technological partnerships and market expansion, helping the company capture a larger share in the rapidly evolving chip market.
See More
QuickLogic Secures Mid-Six-Figure Contract to Enhance eFPGA Technology
- Contract Signing: QuickLogic Corporation has signed a mid-six-figure contract to implement architectural enhancements for its eFPGA Hard IP, indicating strong market demand and the company's competitive positioning.
- Technical Enhancements: The enhancements lower power consumption, increase performance, and reduce the silicon area (PPA) required for high-density eFPGA cores, allowing QuickLogic to extend its technology applications across advanced fabrication nodes.
- Market Positioning: VP Andy Jaros stated that with significant PPA improvements developed in 2025, QuickLogic is well-positioned to meet the demands for very high-density eFPGA cores and large discrete FPGA requirements, showcasing enhanced market adaptability.
- Expanded Application Scope: By improving responsiveness to cost-sensitive applications, QuickLogic anticipates significantly broadening its market scope and use cases, further solidifying its leadership in the embedded FPGA sector.
See More
