Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Sep 30 2024
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Source: Businesswire
New Technology Launch: Alphawave Semi has introduced the first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die IP subsystem, designed for high-demand applications like hyperscale data centers and AI, utilizing TSMC’s advanced packaging technology.
Performance and Compliance: The UCIe IP subsystem supports multiple industry protocols, operates at speeds of 24 Gbps, and has been rigorously validated against UCIe standards, marking a significant milestone in high-performance connectivity solutions.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
