StableX Technologies purchases Chainlink tokens
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Oct 16 2025
0mins
Should l Buy SBLX?
- Strategic Acquisition: StableX Technologies has completed its second strategic token purchase.
- Token Details: The acquisition involved Chainlink tokens.
Trade with 70% Backtested Accuracy
Stop guessing "Should I Buy SBLX?" and start using high-conviction signals backed by rigorous historical data.
Sign up today to access powerful investing tools and make smarter, data-driven decisions.
Analyst Views on SBLX
About SBLX
StableX Technologies Inc, formerly, AYRO, Inc., is focused on the acquisition and development of stablecoin assets, infrastructure and related technologies. The Company aims to deliver sustainable long-term returns by capitalizing on the expanding role of stablecoins in global commerce and finance. The Company takes a picks and shovels approach by investing in the core infrastructure and foundational tokens that power the stablecoin ecosystem.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
Fabric.AI Transitions to New Ticker and Focuses on AI Infrastructure
- Ticker Change: Fabric.AI officially begins trading under the new ticker symbol 'FABC' on Nasdaq as of April 29, 2026, marking a successful transformation from StableX Technologies and a strategic shift towards building foundational infrastructure for AI systems, which is expected to enhance market visibility and attract more investor interest.
- Strategic Partnership: The company has formed a strategic alliance with Kopin Corporation to develop MicroLED-based optical interconnects, aimed at dramatically increasing data transfer speeds and energy efficiency within AI data centers, representing a significant product initiative that opens up a market opportunity exceeding $100 billion, thereby positioning Fabric.AI as a leader in AI infrastructure.
- Focus on Technology Development: Fabric.AI is reallocating capital to accelerate the development of its core semiconductor technologies, particularly MicroLED optical interconnects and other critical system solutions, which are designed to address bottlenecks in AI data centers, thus enhancing overall operational efficiency and competitive positioning in the market.
- Market Positioning and Vision: CEO Josh Silverman emphasized that this change is not just a rebranding but a commitment to becoming a foundational layer in the AI economy, with Fabric.AI aiming to enable efficient scaling of AI systems, further solidifying its position in the rapidly evolving AI market.
See More
Kopin Secures $15M Order with Fabric.AI for Neural I/o™ Development
- Strategic Partnership: Kopin has secured a $15 million initial development order with Fabric.AI to jointly develop MicroLED-based optical interconnect technology, aimed at replacing traditional copper wiring, significantly reducing energy consumption and enhancing performance in data centers.
- Technological Innovation: The newly developed Neural I/o™ technology leverages Kopin's MicroLED and bi-directional NeuralDisplay™ architecture, enabling ultra-high-speed data transmission at significantly lower power consumption, which is expected to fundamentally reshape the AI hardware ecosystem.
- Market Potential: Kopin's deep expertise in MicroLED display technology positions it strategically in the rapidly growing AI infrastructure market, which is anticipated to provide substantial long-term growth opportunities for the company.
- Management Outlook: Kopin's CEO Michael Murray stated that this collaboration will overcome current interconnect bottlenecks and facilitate efficient GPU communication, aligning with the market's urgent demand for AI acceleration, indicating the company's future growth potential.
See More
Fabric.AI Launches New Semiconductor Technologies for AI Infrastructure
- Technological Innovation: Fabric.AI's Neural I/o™ chip, leveraging Kopin's programmable MicroLED technology, replaces traditional electrical interconnects to achieve ultra-high bandwidth and low-latency data transmission, significantly enhancing AI computing efficiency and positioning the company to lead in the $138 billion interconnect market.
- Strategic Collaboration: The partnership with Kopin Corporation will jointly develop next-generation optical communication systems, with Kopin acquiring a 19.9% stake in Fabric.AI, which not only accelerates technological innovation but also strengthens both companies' competitive edge in AI infrastructure.
- Financing Plan: Fabric.AI plans to raise $21.5 million through a private placement of 21,500 shares of its new Series K convertible preferred stock, with an initial conversion price of $2.51 per share, aimed at accelerating the development of core technologies and solidifying its position in AI infrastructure.
- Corporate Restructuring: Fabric.AI officially changes its name to Fabric.AI, Inc. and will change its stock symbol to FABC, reflecting the company's strategic shift from a digital asset strategy to a focus on AI infrastructure, aiming to capture significant growth opportunities in the AI market.
See More
Pitney Bowes Names Todd Everett, a Skilled Leader in Shipping and Technology, as President of Sending Technology Solutions
Leadership Changes at Pitney Bowes: Todd Everett has been appointed as EVP and President of Sending Technology Solutions (SendTech), transitioning from the Board of Directors, while Wayne Walker joins as an independent board member, filling the vacancy left by Everett.
Strategic Review of Financial Services: The company is implementing a new leadership structure for Pitney Bowes Bank and Global Financial Services to maximize their value, with direct reporting to CEO Kurt Wolf and CFO Paul Evans.
See More
Fabric.AI Transitions to New Ticker and Focuses on AI Infrastructure
- Ticker Change: Fabric.AI officially begins trading under the new ticker symbol 'FABC' on Nasdaq as of April 29, 2026, marking a successful transformation from StableX Technologies and a strategic shift towards building foundational infrastructure for AI systems, which is expected to enhance market visibility and attract more investor interest.
- Strategic Partnership: The company has formed a strategic alliance with Kopin Corporation to develop MicroLED-based optical interconnects, aimed at dramatically increasing data transfer speeds and energy efficiency within AI data centers, representing a significant product initiative that opens up a market opportunity exceeding $100 billion, thereby positioning Fabric.AI as a leader in AI infrastructure.
- Focus on Technology Development: Fabric.AI is reallocating capital to accelerate the development of its core semiconductor technologies, particularly MicroLED optical interconnects and other critical system solutions, which are designed to address bottlenecks in AI data centers, thus enhancing overall operational efficiency and competitive positioning in the market.
- Market Positioning and Vision: CEO Josh Silverman emphasized that this change is not just a rebranding but a commitment to becoming a foundational layer in the AI economy, with Fabric.AI aiming to enable efficient scaling of AI systems, further solidifying its position in the rapidly evolving AI market.
See More
Kopin Secures $15M Order with Fabric.AI for Neural I/o™ Development
- Strategic Partnership: Kopin has secured a $15 million initial development order with Fabric.AI to jointly develop MicroLED-based optical interconnect technology, aimed at replacing traditional copper wiring, significantly reducing energy consumption and enhancing performance in data centers.
- Technological Innovation: The newly developed Neural I/o™ technology leverages Kopin's MicroLED and bi-directional NeuralDisplay™ architecture, enabling ultra-high-speed data transmission at significantly lower power consumption, which is expected to fundamentally reshape the AI hardware ecosystem.
- Market Potential: Kopin's deep expertise in MicroLED display technology positions it strategically in the rapidly growing AI infrastructure market, which is anticipated to provide substantial long-term growth opportunities for the company.
- Management Outlook: Kopin's CEO Michael Murray stated that this collaboration will overcome current interconnect bottlenecks and facilitate efficient GPU communication, aligning with the market's urgent demand for AI acceleration, indicating the company's future growth potential.
See More
Fabric.AI Launches New Semiconductor Technologies for AI Infrastructure
- Technological Innovation: Fabric.AI's Neural I/o™ chip, leveraging Kopin's programmable MicroLED technology, replaces traditional electrical interconnects to achieve ultra-high bandwidth and low-latency data transmission, significantly enhancing AI computing efficiency and positioning the company to lead in the $138 billion interconnect market.
- Strategic Collaboration: The partnership with Kopin Corporation will jointly develop next-generation optical communication systems, with Kopin acquiring a 19.9% stake in Fabric.AI, which not only accelerates technological innovation but also strengthens both companies' competitive edge in AI infrastructure.
- Financing Plan: Fabric.AI plans to raise $21.5 million through a private placement of 21,500 shares of its new Series K convertible preferred stock, with an initial conversion price of $2.51 per share, aimed at accelerating the development of core technologies and solidifying its position in AI infrastructure.
- Corporate Restructuring: Fabric.AI officially changes its name to Fabric.AI, Inc. and will change its stock symbol to FABC, reflecting the company's strategic shift from a digital asset strategy to a focus on AI infrastructure, aiming to capture significant growth opportunities in the AI market.
See More
Pitney Bowes Names Todd Everett, a Skilled Leader in Shipping and Technology, as President of Sending Technology Solutions
Leadership Changes at Pitney Bowes: Todd Everett has been appointed as EVP and President of Sending Technology Solutions (SendTech), transitioning from the Board of Directors, while Wayne Walker joins as an independent board member, filling the vacancy left by Everett.
Strategic Review of Financial Services: The company is implementing a new leadership structure for Pitney Bowes Bank and Global Financial Services to maximize their value, with direct reporting to CEO Kurt Wolf and CFO Paul Evans.
See More
