Fabric.AI Unveils Neural I/o Platform for AI Infrastructure
Written by Emily J. Thompson, Senior Investment Analyst
Updated: May 18 2026
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Source: Newsfilter
- Technological Innovation: Fabric.AI expects to demonstrate its Neural I/o™ MicroLED-based optical interconnect platform by the end of 2026, addressing critical data transfer bottlenecks in AI data centers, marking a significant advancement in AI infrastructure.
- Market Potential: The company believes the market opportunity for next-generation AI interconnects could exceed $100 billion annually, emphasizing the value capture potential of leading technology platforms in such a vast market, showcasing Fabric.AI's strategic positioning in the industry.
- Financial Position: Fabric.AI currently has approximately $30 million in cash and cash equivalents, which is sufficient to fund operations through the planned Neural I/o™ demonstration milestone, ensuring financial stability during the technology development process.
- Industry Trends: As AI models scale rapidly, industry leaders increasingly emphasize networking and interconnect performance, with NVIDIA founder Jensen Huang stating that the datacenter is the new unit of computing, highlighting that interconnect efficiency directly impacts AI productivity and economics, aligning perfectly with Fabric.AI's technology.
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About FABC
Fabric.AI, Inc., formerly StableX Technologies Inc, is an infrastructure company building a suite of fabless semiconductor technologies to power AI factories - smart data centers optimized for producing intelligence at scale. It is a developer of fabless semiconductor solutions for AI infrastructure, to develop MicroLED-based optical interconnect technology that will be designed to replace traditional copper wiring between GPUs and high-performance processors for smart data centers. The Company builds MicroLED-based optical interconnects and other system-critical semiconductor solutions designed to unlock faster, more efficient, and more scalable AI workloads.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
Fabric.AI Engages Egon Zehnder for Senior Project Management Search
- Executive Search Initiative: Fabric.AI has engaged Egon Zehnder, a leading global executive search firm, to find a senior project management executive, aiming to enhance coordination in complex engineering and product development, thereby improving overall operational efficiency.
- Technological Collaboration Progress: The company is advancing its MicroLED optical interconnect technology in partnership with Kopin Corporation, which is expected to address data transmission bottlenecks in AI data centers, enhancing speed and energy efficiency while boosting market competitiveness.
- Leadership Team Development: The new project management executive will help coordinate multiple high-priority development programs, as Fabric.AI seeks to strengthen its leadership to achieve long-term growth objectives in the AI infrastructure sector.
- Clear Strategic Vision: CEO Josh Silverman emphasized that the company's goal is to solve bottlenecks in AI infrastructure through breakthrough technologies, and the involvement of Egon Zehnder will provide the necessary operational discipline and leadership support.
See More
Fabric.AI Unveils Neural I/o Platform for AI Infrastructure
- Technological Innovation: Fabric.AI expects to demonstrate its Neural I/o™ MicroLED-based optical interconnect platform by the end of 2026, addressing critical data transfer bottlenecks in AI data centers, marking a significant advancement in AI infrastructure.
- Market Potential: The company believes the market opportunity for next-generation AI interconnects could exceed $100 billion annually, emphasizing the value capture potential of leading technology platforms in such a vast market, showcasing Fabric.AI's strategic positioning in the industry.
- Financial Position: Fabric.AI currently has approximately $30 million in cash and cash equivalents, which is sufficient to fund operations through the planned Neural I/o™ demonstration milestone, ensuring financial stability during the technology development process.
- Industry Trends: As AI models scale rapidly, industry leaders increasingly emphasize networking and interconnect performance, with NVIDIA founder Jensen Huang stating that the datacenter is the new unit of computing, highlighting that interconnect efficiency directly impacts AI productivity and economics, aligning perfectly with Fabric.AI's technology.
See More
Fabric.AI Appoints New Head of Development for Neural I/o Chip Program
- Executive Appointment: Fabric.AI has appointed Bill Maffucci as Head of Development for the Neural I/o chip program, leveraging his over ten years of optical and product development experience to accelerate this critical technology's advancement, thereby enhancing the company's competitive edge in the AI infrastructure market.
- Technological Innovation: The Neural I/o chip utilizes MicroLED optical interconnect technology, designed to overcome the limitations of traditional copper and laser interconnects, expected to significantly reduce power consumption and increase bandwidth density, addressing the demands of modern AI workloads and positioning the company favorably in the rapidly growing semiconductor market.
- Market Potential: Industry analysts project that the data center optical interconnect market will reach tens of billions of dollars in the coming years, with Fabric.AI's technological innovations poised to capture significant market share, particularly in the core areas of AI factory and data center buildouts.
- Strategic Collaboration: The partnership between Fabric.AI and Kopin is further strengthened, as both companies focus on MicroLED innovation and optical interconnect technology development; Maffucci's addition signifies a strategic move towards building a world-class team, expected to accelerate the commercialization of these technologies.
See More
Fabric.AI Engages Egon Zehnder for Senior Project Management Search
- Executive Search Initiative: Fabric.AI has engaged Egon Zehnder, a leading global executive search firm, to find a senior project management executive, aiming to enhance coordination in complex engineering and product development, thereby improving overall operational efficiency.
- Technological Collaboration Progress: The company is advancing its MicroLED optical interconnect technology in partnership with Kopin Corporation, which is expected to address data transmission bottlenecks in AI data centers, enhancing speed and energy efficiency while boosting market competitiveness.
- Leadership Team Development: The new project management executive will help coordinate multiple high-priority development programs, as Fabric.AI seeks to strengthen its leadership to achieve long-term growth objectives in the AI infrastructure sector.
- Clear Strategic Vision: CEO Josh Silverman emphasized that the company's goal is to solve bottlenecks in AI infrastructure through breakthrough technologies, and the involvement of Egon Zehnder will provide the necessary operational discipline and leadership support.
See More
Fabric.AI Unveils Neural I/o Platform for AI Infrastructure
- Technological Innovation: Fabric.AI expects to demonstrate its Neural I/o™ MicroLED-based optical interconnect platform by the end of 2026, addressing critical data transfer bottlenecks in AI data centers, marking a significant advancement in AI infrastructure.
- Market Potential: The company believes the market opportunity for next-generation AI interconnects could exceed $100 billion annually, emphasizing the value capture potential of leading technology platforms in such a vast market, showcasing Fabric.AI's strategic positioning in the industry.
- Financial Position: Fabric.AI currently has approximately $30 million in cash and cash equivalents, which is sufficient to fund operations through the planned Neural I/o™ demonstration milestone, ensuring financial stability during the technology development process.
- Industry Trends: As AI models scale rapidly, industry leaders increasingly emphasize networking and interconnect performance, with NVIDIA founder Jensen Huang stating that the datacenter is the new unit of computing, highlighting that interconnect efficiency directly impacts AI productivity and economics, aligning perfectly with Fabric.AI's technology.
See More
Fabric.AI Appoints New Head of Development for Neural I/o Chip Program
- Executive Appointment: Fabric.AI has appointed Bill Maffucci as Head of Development for the Neural I/o chip program, leveraging his over ten years of optical and product development experience to accelerate this critical technology's advancement, thereby enhancing the company's competitive edge in the AI infrastructure market.
- Technological Innovation: The Neural I/o chip utilizes MicroLED optical interconnect technology, designed to overcome the limitations of traditional copper and laser interconnects, expected to significantly reduce power consumption and increase bandwidth density, addressing the demands of modern AI workloads and positioning the company favorably in the rapidly growing semiconductor market.
- Market Potential: Industry analysts project that the data center optical interconnect market will reach tens of billions of dollars in the coming years, with Fabric.AI's technological innovations poised to capture significant market share, particularly in the core areas of AI factory and data center buildouts.
- Strategic Collaboration: The partnership between Fabric.AI and Kopin is further strengthened, as both companies focus on MicroLED innovation and optical interconnect technology development; Maffucci's addition signifies a strategic move towards building a world-class team, expected to accelerate the commercialization of these technologies.
See More
