Alphawave Semi Launches Industry’s First 3nm UCIe IP with TSMC CoWoS Packaging
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Jul 30 2024
0mins
Source: businesswire
Launch of 3nm UCIe IP: Alphawave Semi has successfully launched the industry's first 3nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die IP in collaboration with TSMC, targeting high-performance computing and AI applications.
Technological Advancements: The new subsystem features advanced packaging technology that supports multiple protocols, offers high bandwidth density, and includes health monitoring capabilities, setting a new benchmark for connectivity solutions.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
