ACM Research (ACMR) to Announce Q4 Earnings on January 22, EPS Expected to Drop 16.1%
Written by Emily J. Thompson, Senior Investment Analyst
Updated: 1h ago
0mins
Source: seekingalpha
- Earnings Announcement: ACM Research is set to announce its Q4 earnings on January 22 before market open, with consensus EPS estimate at $0.47, reflecting a 16.1% year-over-year decline, which may impact investor sentiment.
- Revenue Expectations: The revenue estimate for Q4 stands at $248.42 million, representing an 11.4% year-over-year increase, indicating the company's ongoing growth potential in the semiconductor materials market despite broader economic pressures.
- Performance Record: Over the past two years, ACM Research has beaten EPS and revenue estimates 88% of the time, showcasing its strong capabilities in market analysis and performance management, which may attract more investor interest.
- Estimate Revisions: In the last three months, there have been no upward revisions to EPS estimates and four downward revisions, while revenue estimates faced seven downward adjustments, reflecting a cautious market outlook on the company's future performance.
Analyst Views on ACMR
Wall Street analysts forecast ACMR stock price to fall over the next 12 months. According to Wall Street analysts, the average 1-year price target for ACMR is 41.80 USD with a low forecast of 36.00 USD and a high forecast of 45.00 USD. However, analyst price targets are subjective and often lag stock prices, so investors should focus on the objective reasons behind analyst rating changes, which better reflect the company's fundamentals.
6 Analyst Rating
5 Buy
1 Hold
0 Sell
Strong Buy
Current: 51.160
Low
36.00
Averages
41.80
High
45.00
Current: 51.160
Low
36.00
Averages
41.80
High
45.00
About ACMR
ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
