Synopsys and Samsung Collaborate on AI Tools for Advanced Nodes
Written by Emily J. Thompson, Senior Investment Analyst
Updated: 2 days ago
0mins
Source: PRnewswire
- AI-Powered EDA Tools: Synopsys announced at the SAFE Forum its collaboration with Samsung Foundry to launch a portfolio of production-ready AI-powered EDA tools, aimed at accelerating customers' ability to bring AI and multi-die designs to market while significantly improving product quality.
- Design and Manufacturing Synergy: CEO Sassine Ghazi emphasized that addressing semiconductor engineering complexity and development cycle pressures requires a fundamentally new approach that fuses AI-driven automation with multiphysics intelligence to enhance efficiency across design and manufacturing processes.
- Risk Mitigation in Design: Samsung's VP Hyung-Ock Kim noted that the close collaboration provides silicon-based, customer-validated solutions that help clients reduce design integration risks and improve silicon predictability, enabling a more confident transition from design to production.
- Rapid Market Delivery: The collaboration translates years of Design Technology Co-Optimization (DTCO) into solutions that empower customers to quickly bring advanced designs to market while achieving significant advantages in complexity management and risk reduction.
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Analyst Views on SNPS
Wall Street analysts forecast SNPS stock price to rise
12 Analyst Rating
10 Buy
2 Hold
0 Sell
Strong Buy
Current: 480.640
Low
500.00
Averages
565.64
High
602.00
Current: 480.640
Low
500.00
Averages
565.64
High
602.00
About SNPS
Synopsys, Inc. is engaged in providing engineering solutions from silicon to systems, enabling customers to innovate artificial intelligence (AI)-powered products. It delivers silicon design, intellectual property (IP), simulation and analysis solutions, and design services. It supplies mission-critical electronic design automation (EDA) software that engineers use to design and test integrated circuits (ICs). Its Design Automation segment includes its advanced silicon design, verification products and services, and Ansys products, and system integration products and services. This segment also includes digital, custom and field programmable gate array integrated circuit design software, verification software and hardware products, and manufacturing software products. Its Design IP segment includes its logic libraries, embedded memories, wired interface IP, memory interface IP, security IP, and embedded processors that serve companies in the semiconductor and electronics industries.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
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- Market Competitive Pressure: While Huawei's technological innovation is seen as a breakthrough, industry experts argue that many of the underlying ideas resemble existing work in 3D stacking and advanced packaging, suggesting it may not pose a threat to TSMC, which has nearly a decade of experience in this area.
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- Design and Manufacturing Synergy: CEO Sassine Ghazi emphasized that addressing semiconductor engineering complexity and development cycle pressures requires a fundamentally new approach that fuses AI-driven automation with multiphysics intelligence to enhance efficiency across design and manufacturing processes.
- Risk Mitigation in Design: Samsung's VP Hyung-Ock Kim noted that the close collaboration provides silicon-based, customer-validated solutions that help clients reduce design integration risks and improve silicon predictability, enabling a more confident transition from design to production.
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- New Design Principle: Huawei's newly unveiled chip design principle focuses on enhancing transmission speed rather than continuing to shrink semiconductor sizes, offering a new path for China to develop cutting-edge chips despite U.S. sanctions, which could reshape the industry landscape over the next decade.
- Logic Folding Technology: The core technique, LogicFolding, aims to stack logic, analog, and memory circuits in tighter structures, potentially improving chip density and efficiency, although the actual breakthrough of this method remains to be validated over time.
- Market Competitive Pressure: While Huawei's technological innovation is seen as a breakthrough, industry experts argue that many of the underlying ideas resemble existing work in 3D stacking and advanced packaging, suggesting it may not pose a threat to TSMC, which has nearly a decade of experience in this area.
- New Kirin Chip Launch: Huawei's upcoming Kirin smartphone chip, which will utilize the LogicFolding architecture, is expected to improve power efficiency by 41% and peak operating speed by nearly 13%, and if achieved at commercial scale, it could significantly impact the market.
See More
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- Earnings Report: Photronics reported fiscal Q2 non-GAAP net income and sales below analysts' expectations, indicating challenges the company faces in the current market environment, which may affect investor confidence.
- Market Reaction: The disappointing performance could lead to negative impacts on Photronics' stock performance, prompting investors to reassess its future growth potential and potentially causing stock price volatility.
- Industry Context: The decline in Photronics' performance reflects intensified competition and uncertainty in market demand within the semiconductor industry, which may influence the company's long-term strategic planning.
- Outlook: Despite the current underperformance, Photronics needs to develop effective strategies to restore market confidence and drive future growth, particularly in terms of technological innovation and market expansion.
See More
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- Chipmaker Stock Surge: Arm Holdings' shares jumped over 15% after Mizuho raised its price target from $290 to $360, anticipating strong growth from internal CPU demand in 2027, which boosts market confidence in its future performance.
- Rail Merger Halted: Shares of Norfolk Southern and Union Pacific fell about 4% after the Surface Transportation Board halted its review of the proposed $71.5 billion merger, indicating regulatory concerns that could impact future market consolidation.
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See More
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- AI-Powered EDA Tools: Synopsys announced at the SAFE Forum its collaboration with Samsung Foundry to launch a portfolio of production-ready AI-powered EDA tools, aimed at accelerating customers' ability to bring AI and multi-die designs to market while significantly improving product quality.
- Design and Manufacturing Synergy: CEO Sassine Ghazi emphasized that addressing semiconductor engineering complexity and development cycle pressures requires a fundamentally new approach that fuses AI-driven automation with multiphysics intelligence to enhance efficiency across design and manufacturing processes.
- Risk Mitigation in Design: Samsung's VP Hyung-Ock Kim noted that the close collaboration provides silicon-based, customer-validated solutions that help clients reduce design integration risks and improve silicon predictability, enabling a more confident transition from design to production.
- Rapid Market Delivery: The collaboration translates years of Design Technology Co-Optimization (DTCO) into solutions that empower customers to quickly bring advanced designs to market while achieving significant advantages in complexity management and risk reduction.
See More
Synopsys and Samsung Unveil Next-Gen 2nm Process Innovations
- AI-Driven Design Flows: Synopsys has launched AI-powered digital and analog flows that are production-ready for the third-generation 2nm process, enabling customers to migrate swiftly to Samsung's advanced nodes, thereby accelerating time-to-market and enhancing competitive positioning.
- Test Efficiency Gains: Collaborating with Samsung Foundry, Synopsys's AI-assisted Automatic Test Pattern Generation (ATPG) technology reduces test cycles by 20%, significantly lowering testing costs while improving design quality, which boosts customer confidence in their products.
- Multiphysics Analysis Platform: The Synopsys 3DIC Compiler supports Samsung's Hybrid Copper Bonding technology, providing a unified exploration-to-signoff platform that optimizes integrated compute, memory, and advanced packaging systems, enhancing designer productivity and quality of results.
- Expanded IP Portfolio: Synopsys offers a broad portfolio of interface IP spanning from 14nm to the latest 2nm processes, reducing design integration risks and supporting applications in high-performance computing, consumer electronics, and automotive sectors, ensuring customers can bring products to market quickly.
See More
Synopsys Q2 Results Exceed Estimates Amid Analyst Optimism
- Earnings Beat: Synopsys' Q2 results and outlook surpassed estimates, with shares falling about 5% on Thursday; however, analysts remain optimistic, as J.P. Morgan maintains an Overweight rating and a $650 price target.
- Positive Growth Outlook: Analysts noted an upward revision in FY26 guidance, projecting high-single-digit growth for EDA and sequential improvement in Design IP, with Ansys revenues expected to reach $2.96 billion, indicating strong market demand and sustained growth potential.
- AI Infrastructure Boost: Leading-edge chip design activity remains robust due to the accelerating demand for AI infrastructure and custom silicon, which analysts believe will further enhance Synopsys' market performance and product demand.
- Exploring New Business Models: Management expects to sign initial customers for new value-based business models by the end of FY26, laying the groundwork for broader monetization in FY27, showcasing the company's strategic positioning and future growth potential in the AI sector.
See More
