DAIO News & Events

Data I/O announced the execution of a letter of intent to acquire a manufacturer of semiconductor handling and packaging solutions. Upon closing of the transaction, the acquisition is expected to nearly double the annual revenues of Data I/O as well as be accretive to earnings and cash flow. Data I/O expects to fund this acquisition with a combination of cash and equity for total consideration of approximately $23M. The equity component will consist of up to $3M of the company's common stock based on future performance of the acquired business. The closing of the transaction, expected before the end of the Company's third quarter, is subject to completion of definitive documentation as well as customary closing and financing conditions, regulatory approvals and additional due diligence. Additional deal terms will not be disclosed.

Data I/O announced the companies are collaborating to deliver a solution that unifies security provisioning throughout the supply chain from embedded design into mass production manufacturing. "Collaborating with IAR allows us to extend our security provisioning capabilities upstream into the design phase, creating an unprecedented end-to-end solution for our customers. The synergy is clear: IAR brings world-class embedded development expertise, and their customers trust them to define security from the earliest stages, while Data I/O brings decades of experience in reliable, scalable device programming for volume manufacturing," said William Wentworth, President and CEO of Data I/O Corporation. "Together, we're not just offering tools-we're delivering a complete security ecosystem that empowers OEMs to meet evolving regulatory requirements while maintaining the agility to compete globally. This is the kind of collaboration that strengthens both companies and creates substantial value for our customers."

Data I/O files $20M mixed securities shelf