ASX News & Events

Advanced Semiconductor Engineering announced the development of an industry-first automated 310mm x 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in the first half of 2027.

Reports April ATM revenue $1.27B, up 33.6%.

Reports Q1 revenue NT$112.43M vs. NT$88.67M last year. The company said, "Net revenues from packaging operations, testing operations, EMS operations, and others represented approximately 51%, 12%, 36%, and 1% of the total net revenues for the quarter, respectively. Cost of revenues was NT$138,812 million for the quarter, down from NT$143,179 million in 4Q25."