Advanced Semiconductor Engineering Develops First 310mm Panel Packaging Production Line
Advanced Semiconductor Engineering announced the development of an industry-first automated 310mm x 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in the first half of 2027.
