TSMC and Amkor Sign 10-Year Agreement
Taiwan Semiconductor Manufacturing (TSM) and Amkor Technology (AMKR) announced a 10-year agreement to foster a partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem. The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model while strengthening their ability to support customers' evolving requirements.
