Tikehau Capital Announces the Successful Completion of Its Tender Offer Alongside Its New Bond Issue
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Apr 07 2025
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Source: Yahoo Finance
Successful Bond Placement: Tikehau Capital successfully placed a €500 million bond issue with a maturity of April 2031, attracting strong investor demand and oversubscription of 2.8 times, reflecting confidence in the company's credit profile.
Tender Offer Completion: The company completed a tender offer for €200 million of existing bonds maturing in October 2026, which will be cancelled, allowing Tikehau to manage its debt maturity profile more efficiently.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
