STMicro to allocate $60 million for restructuring of French facility
Investment Announcement: STMicroelectronics has announced a $60 million investment to develop a pilot line for advanced semiconductor manufacturing technology at its plant in Tours, France.
New Technology Implementation: The company will utilize Panel-Level Packaging (PLP) technology, which allows for manufacturing chips on large panels, aiming to enhance production efficiency and reduce costs in Europe.
Restructuring and Job Cuts: STMicro is undergoing a major restructuring, moving older chipmaking lines away from Tours and planning job cuts, which have faced opposition from unions and stakeholders.
Operational Timeline: The pilot line is expected to be operational by the third quarter of 2026, supporting the company's long-term success in the semiconductor market.
About the author









