Significant Friday Options Trading: BE, AMKR, ZS
Written by Emily J. Thompson, Senior Investment Analyst
Updated: Dec 12 2025
0mins
Source: NASDAQ.COM
Amkor Technology Options Trading: Amkor Technology Inc. (AMKR) experienced a significant options trading volume of 15,618 contracts, equating to about 1.6 million underlying shares, with notable activity in the $40 strike call option expiring June 18, 2026.
Zscaler Options Trading: Zscaler Inc. (ZS) recorded an options trading volume of 10,208 contracts, representing approximately 1.0 million underlying shares, with high volume observed in the $220 strike put option expiring February 20, 2026.
Trading Volume Context: The options trading volumes for both companies represent around 44.4% of AMKR's and 43.2% of ZS's average daily trading volumes over the past month.
Further Information: For additional details on available expirations for options related to AMKR, ZS, or other companies, StockOptionsChannel.com can be visited.
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Analyst Views on AMKR
Wall Street analysts forecast AMKR stock price to fall over the next 12 months. According to Wall Street analysts, the average 1-year price target for AMKR is 42.14 USD with a low forecast of 28.00 USD and a high forecast of 62.00 USD. However, analyst price targets are subjective and often lag stock prices, so investors should focus on the objective reasons behind analyst rating changes, which better reflect the company's fundamentals.
9 Analyst Rating
4 Buy
5 Hold
0 Sell
Moderate Buy
Current: 50.960
Low
28.00
Averages
42.14
High
62.00
Current: 50.960
Low
28.00
Averages
42.14
High
62.00
About AMKR
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
About the author
Emily J. Thompson
Emily J. Thompson, a Chartered Financial Analyst (CFA) with 12 years in investment research, graduated with honors from the Wharton School. Specializing in industrial and technology stocks, she provides in-depth analysis for Intellectia’s earnings and market brief reports.
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