Resonac Forms 27-Member "JOINT3" Consortium to Advance Next-Generation Semiconductor Packaging

Establishment of JOINT3 Consortium: Resonac Corporation has formed a consortium called JOINT3, comprising 27 global companies, to collaboratively develop materials, equipment, and design tools for panel-level organic interposers, utilizing a prototype production line set to begin operations in 2026.

Focus on Advanced Semiconductor Packaging: The initiative aims to address challenges in semiconductor packaging technology, particularly the transition from silicon to organic interposers, which are essential for enhancing data communication capacity and speed in next-generation semiconductors.