Quectel stellt innovative Matter-over-Thread-Module vor, um eine reibungslose Interoperabilität von Geräten zu gewährleisten.

Introduction of KGM133S Modules: Quectel Wireless Solutions has launched the KGM133S, the first in a series of Matter-over-Thread modules designed to enhance connectivity in smart home applications like smart locks, sensors, and lighting.

Technical Specifications: The KGM133S modules are built on Silicon Labs' EFR32MG24 chip, support the Matter 1.4 protocol, and enable seamless integration across various ecosystems including Apple Home, Google Home, and Amazon Alexa.

Advantages of Thread Technology: The modules utilize Thread technology, which simplifies network architecture by allowing direct internet connections without the need for complex gateways, thus reducing latency and power consumption.

Future Development and Security Features: The KGM133S series not only meets current smart home connectivity needs but also includes Zigbee 3.0 and Bluetooth LE 6.0 support, along with enhanced security features like Secure Vault, ensuring long-term competitiveness and adaptability in the IoT market.